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Nordson YESTECH's FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability.

Solder Paste Inspection

  • High Accuracy at Fastest Speed
  • Full "on the fly" 3D solder paste metrology
  • Feedback, Feed Forward Ready (I 4.0)
  • Proprietary strobe lighting
  • Built in barcode reading for traceability
  • Intuitive software with touch screen programming


The new special warp compensation algorithm allows high speed compensation for warp on complex shapes contained within a field of view. The new improved ultrafast 3D sensor combined with a unique 'all-in-one' scan technique - that integrates fiducial, barcode and range scans into one, seamless scan sequence - makes the FX-500 ULTRA 3D SPI one of the fastest systems in the market.

The use of high speed "on the fly" inspection allows to minimize vibrations effects delivering greater accuracy and best in class repeatability.

Complementing Nordson's line of optical and X-ray inspection systems, the FX-500 addresses industry 4.0 requirements and provides a valuable link to other Nordson Test and Inspection platforms.