Automated Optical Inspection

The new Dual-Mode MRS sensor in the SE3000™SPI System  provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed inspection and another mode for high resolution inspection. The new sensor is an extension of the proprietary MRS sensor portfolio that  inhibits reflection-based distortions caused by shiny components and surfaces.  The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.

SQ3000 multi-function system for AOI, SPI and CMM can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management. In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours. The world's first In-line CMM includes an extensive software suite for metrology grade measurements on all critical points. 

The SQ3000+ all-in-one solution for AOI, SPI and CMM offers a combination of unmatched high accuracy and high speed, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that inhibits reflection-based distortions caused by shiny components and specular surfaces.
The system is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT, 008004/0201 SPI, socket metrology and other challenging CMM applications.