Featured Think Tank Blogs
Learn more about Nordson Test & Inspection solutions, gain industry insight, and take a deep dive into new cutting-edge metrology equipment and inspection systems.
ACS - Closing the Gap - Wafer Process Controll
Jul 03, 2026The growing importance of micron-level control In advanced semiconductor processes, precise wafer positioning across X,...
Read MoreACS - Closing the Gap - Wafer Process ControllAXM for Advanced Packaging - Technology Talk
Jul 15, 2026I Automated X-ray Metrology (AXM) for Advanced Packaging Let's Talk About Enabling Inline, AI-Driven Yield Optimization...
Read MoreAXM for Advanced Packaging - Technology TalkAI Models Transform Defect Inspection
Jun 15, 2026Majority of AI initiatives falter; synthetic data gaining traction due to limited real-world data. Read the intersting...
Read MoreAI Models Transform Defect InspectionHBM Reliability with 3D X-ray Inspection
May 06, 2026Developing more robust, high-performance components - this must be the goal at a time when it is essential to use...
Read MoreHBM Reliability with 3D X-ray InspectionMore Think Tank Blogs
Nordson Intelligence AI is reshaping the X-ray process
Mar 18, 2026Nordson’s Automated X-ray Metrology represents a shift from inspection to intelligent, inline metrology. By combining...
Read More Nordson Intelligence AI is reshaping the X-ray processHow Optical Inspection Protects Advanced PCBs
Nov 30, 2025If throughput is king, data is queen. We talk about closing the loop from inspection back to the line to prevent bad...
Read More How Optical Inspection Protects Advanced PCBsAXM for Advanced Packaging - Technology Talk
Jul 15, 2026Nordson’s Automated X-ray Metrology represents a shift from inspection to intelligent, inline metrology. By combining...
Read More AXM for Advanced Packaging - Technology Talk