SQ3000M2

Superior performance ideal for wirebond applications. SQ3000M2 automated optical inspection (AOI) ensures product quality is maximized. Improve yields, processes and productivity and reduce costly returns from the field.

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Inspection Capabilities
Field-of-View (FOV)	8.2 x 6.8mm (0.32 x 0.27 in.) (1X
Resolution	3.4µm (1X)
Lighting	Proprietary Fusion Lighting™ multiangle LED
Imaging	5-megapixel color camera (2448 × 2048)
Optics	Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module
AFVM - Metrology module	FVM - Focus Variation Measurement sensor
Device types	JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, waffle pack

System Specifications
System Dimensions	110 x 128 x 143 cm (W x D x H) Height excludes signal-light pole and levelling feet
Weight	≈ 965 kg (2127 lbs.)

Options
	SPC software, Barcode Readers (1D/2D), Programming Software: ePM-AI, Offline Defect Review, Certification Target, CMM Capability, AI Capability, Secondary optics (5X or 10X), Tertiary optics (0.5X).

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