4600 Automated Bondtester
Improve reliability and throughput while reducing human influence.
Overview
The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
Specifications at a Glance
| Testing | |
|---|---|
Test modes Test force Multi-function Cartridge (MFC) Imaging Process monitoring |
Manual + dual camera-assist automation 0.01 gf - 50 kgf Pull, shear + CBP available Autofocus + Compound Surface Imaging (CSI) Auto failure mode ID + wire detection |
| Automation | |
|---|---|
Sample handling Traceability Programming Light tower Factory communication |
Wafer + strip auto load Wafer OCR + strip ID Pattern transfer + file import 3 colour included Optional SECS / GEM & RS 232 |
| Axis Performance | |
|---|---|
Step back accuracy (force dependent) System accuracy (force dependent) Axis travel XY speed and resolution Z speed resolution |
+/- 0.25μm +/- 0.10% - 0.05 % FSL 450 mm x 410 mm x 75 mm Up to 70 mm/s, 100 nm 5 mm/s, 250 nm |
| Installation | |
|---|---|
Footprint (W x D x H) Weight Power Supply Pneumatic supply Vacuum supply (4600-W only) |
1075 mm x 920 mm x 1000 mm 140 kg 90-264 V, AC single phase Min 4.0 Bar Min 500 mm Hg |
Life with Automation
Maximum Operator Comfort
Every operator touch-point is an opportunity to degrade measurement spread. Ensure the most accurate results with operator-free automation.
Repeatable Results
Every time the 100 nm resolution rapid and closed loop motion system ensures the test tool is precise and never misses. Operators cannot match the accuracy and consistency of the test results.
Data is Everything
Achieve maximum data integrity and traceability with full barcode scanning support. Data is made available for your MES or factory host.
Remove the Expert
Paragon™ software is easy to use, so you don’t need to rely on expert operators to run the system. An operator can easily manage multiple systems rather than a single manual machine.
Data Integrity with Automation
Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester
Improve Tool ROI
Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.
Ultimate Product Safety
Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test.
Maximum UPH
Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the device.
Data that correlates
DataSync™
- Save costs and improve ROI - cartridges from older systems are compatible with the latest mainframes
- Guarantee data correlation - results correlate across all platforms from the 4000 Series to the 4800 INTEGRA™
- Seamless transition - no adaptors or cartridge alterations needed
- New mainframes are designed to accommodate new and old cartridge technology
Paragon - Your Automation Software
- Automation assisted GUI
- Build in check list & help
- Multi window views
- Schematic virtual images displayed
Application
Electronic systems have a range of test requirements including wire pull, ball shear, die shear and surface mount shear. Batteries for the automotive industry must ensure the highest level of safety.
Microelectronics
Test every interconnect or die
- Leadframes and strips
- Package substrates
- BGA
- MEM
Battery
For battery systems the intercell connection technology requires mechanical testing in either:
- Wirebond Ribbon
- To Busbar
- Tab Weld
- Destructive mode (sample testing)
- Non-destructive mode (100% testing)
Wafer Level
Test wafers from 2 inches to 8 inches
- Silicon, glass, laminate, composite, compound and warped wafers
- Pillars and bumps <50µm
- Test in any direction with the rotational shear cartridge
Multi Functional Cartridge
Nordson T&I cartridge technology is interchangeable between each of our systems, enabling new data to correlate with data up to 20 years old.
FAQ: Contact Reliability in High-Density Semiconductor Testing
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Q: Why is contact reliability so critical in modern semiconductor devices?
As semiconductor devices become smaller and more complex, the reliability of microscopic interconnects becomes essential to ensure consistent performance, safety, and long-term durability. Even minor defects can lead to significant failures over a product’s lifecycle.
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Q: What are interconnects in semiconductor devices?
Interconnects are tiny conductive pathways that enable signals, power, and data to flow between components. They form the backbone of every semiconductor device and are crucial for overall functionality.
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Q: How does miniaturization impact interconnect reliability?
Miniaturization reduces interconnect dimensions to just a few microns while increasing their density. This makes them more susceptible to variability in materials and manufacturing processes, increasing the risk of defects.
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Q: What is bond testing?
Bond testing is a method used to measure the mechanical strength of interconnects by applying controlled force. It provides quantitative insight into bond integrity and helps identify weak connections early in production.
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Q: How does bond testing differ from traditional inspection methods?
While inspection techniques detect visible or structural defects, bond testing evaluates the actual strength of interconnects, offering deeper insight into long-term reliability.
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Q: Why is bond testing considered a critical control point?
Bond testing directly verifies connection strength, helping manufacturers prevent field failures, improve product yield, and ensure devices meet reliability requirements over their entire lifespan.
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Q: What challenges do advanced packaging technologies introduce?
Advanced packaging methods such as FOWLP and 3D stacking introduce complex material interactions and stress variations, making it harder to maintain consistent bond quality and requiring more precise testing methods.
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Q: Why are automated bond testing systems important?
Automation improves measurement accuracy, repeatability, and throughput while reducing human error. It also enables better traceability and data-driven process optimization.
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Q: How is AI transforming bond testing?
Nordson Intelligence AI enhances bond testing by enabling faster and more consistent failure classification, identifying patterns in data, and helping detect process risks earlier in the production cycle.
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Q: What is the future of bond testing in semiconductor manufacturing?
Bond testing is evolving into an intelligent, data-driven process. Future systems will combine precision measurement, adaptive sampling, automation, and advanced analytics to support next-generation semiconductor technologies.