Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage

What if your semiconductor inspection process could be faster, smarter, and more precise? Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, reveals how 3D X-ray innovations are making that a reality.

• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

Inspection & Metrology Equipment

Our inspection & metrology equipment has been well received globally. Some of our most revered, world-class nondestructive solutions are featured below.

SQ5000Pro for 3D AOI, SPI & CMM

The SQ5000Pro is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for...

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SQ7000+TM Multi-Function for 3D AOI, SPI & CMM

SQ7000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology offers high resolution, high...

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SQ3000M2

Superior performance ideal for wirebond applications. SQ3000M2 automated optical inspection (AOI) ensures product...

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AXI DPCT

AXI Dynamic Planar CT moves x-ray inspection in other dimensions, available for all our AXI products, covering...

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AMI Gen7

The New Generation of C-SAM Technology. The most sophisticated and fully featured C-SAM acoustic microscope for...

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Deep Learning and Advanced AI

Nordson DAGE’s new micro materials tester – Prospector™ is designed for the most advanced failure analysis...

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Nordson Intelligence AI-Hub

Nordson AI-Hub simplifies the development of these models all in one guided workflow optimized for visual inspection...

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Software SMT & Semi

The newly designed V5 series software delivers world-class user experience with its intuitive interface, completely...

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