SQ7000+TM Multi-Function for 3D AOI, SPI & CMM
SQ7000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology offers high resolution, high accuracy and high speed inspection & metrology and remains the only system on the market capable of performing AOI, SPI and CMM in-line.
Product Video SQ7000™+
Overview
Ultra-High Resolution, 5 Micron - Multi-Reflection Suppression (MRS) Technology
The SQ7000+ is powered by Nordson's proprietary 3D sensing technology with sophisticated fusing algorithms that enables metrology grade accuracy at production speed. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.
SQ7000+ offers unmatched accuracy with the advanced MRS sensor technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for accurate measurements. The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ7000+ is specifically designed for advanced applications with the most demanding requirements.
Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications
The SQ7000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.
Intuitive, Easy-to-Use Software - Enable Smarter, Faster Inspection
The multi-award winning SQ7000+ AOI software is a more powerful yet extremely simple software suite designed with an intuitive interface and multi-touch control with 3D image visualization tools. Ultra-fast programming capabilities bring the ease-of-use to a completely new level and significantly speeds setup, simplifies the process, reduces training efforts and minimizes operator interaction – all saving time and cost.
Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDefine for faster set-up and a simplified process. AI² (Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either. AI² does it all for you, powered by a data-rich, pre-loaded library and automated scripts that collect and update models all on their own. With AI², you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI² offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications.
Faster, Highly Accurate Coordinate Measurement (CMM) Suite
NordsonCMM™, a comprehensive software suite of coordinate measurement tools, provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed with the world’s first in-line CMM system for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).
Specifications at a glance
| Inspection Speed | 16 cm²/sec (2D+3D) |
| PCB Size |
Minimum: 50 x 50 mm (2 x 2 in.); Maximum: 420 x 320 mm (16.5 x 12.5 in.) |
| Resolution XY / Z |
5 µm / 0.1 µm |
| Maximum Weight (PCB or Sample) | 10 kg |
| Component Types Inspected |
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
| Solder Joint and Other Defects | Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins |
| Minimum Component Size | 0201 mm (008004 in.) |
| Component Height Clearance | Top: 20 mm ; Bottom: 50 mm |
| Field of View (FOV) |
25 x 25 mm |
| Min./ Max. Feature Height: | Min. 10 µm ; Max. 400 µm at spec, 2.4 mm capability |
| Component Defects | Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more |
|
Coordinate Measurement Capability |
Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset, X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius, Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min / Ave / Sigma / Plus / Minus / Multiple |
Test & Inspection News
Keep up to date with the latest news from Nordson Test & Inspection, including new product launches and press releases.
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