AXM XM8000 Pro™
XM8000 Pro™ Series - Redefining Precision 3D Metrology
Building upon a solid platform and a wealth of real-world customer experience, the next generation Nordson XM8000 Pro series addresses future semiconductor metrology needs.
Equipped with an advanced imaging chain utilizing the latest Nordson NT4D, a fan-less dual-mode tube with high-resolution mode and ONYX for low-noise 50µm pixel, 6.5MP detector.
Overview
Designed for the most demanding advanced packaging applications, Nordson’s XM8000 Pro Series sets a new benchmark in high performance 3D metrology. Engineered for exceptional repeatability and accuracy, the XM8000 Pro delivers sub micron level 3D reconstruction with unmatched imaging fidelity and throughput.
Leveraging enhanced optical imaging, advanced 3D algorithms, and high speed acquisition, the system enables precise, repeatable measurements across complex wafer and panel architectures. Multiple projection angles up to 45° provide comprehensive visibility into critical interconnect features, ensuring the integrity and reliability of advanced wafer level packaging (WLP) and panel level packaging (PLP) processes.
The XM8000 7 Pro extends this capability with high throughput metrology of Through Silicon Vias (TSVs). Using advanced 3D analysis techniques, the system accurately characterizes TSV shape, depth, fill quality, and voiding at sub micron resolution, enabling early detection of defects and tight process control.
Built to meet the precision and productivity requirements of next generation semiconductor manufacturing, the XM8000 Pro Series empowers manufacturers to achieve higher yields, tighter tolerances, and superior device reliability—at production speed.
Unbeatable Resolution
100nm defect recognition opens up a whole new world of X-ray metrology applications. The patented NT100M X-ray tube, unique to Nordson Test & Inspection, is 10 times brighter and intrinsically more stable than conventional X-ray tubes. NT100M utilizes a LaB6 emitter instead of the traditional tungsten filament, which typically only achieves 350nm defect recognition.
XM8000 Pro Series with IC Safe™: Inspect with Confidence, Not Exposure
As devices become more complex and sensitive to radiation exposure, providing protection is ever more paramount. IC-Safe Technology, unique to Nordson Test & Inspection, allows products to be safely inspected in-line without risk of radiation damage. IC-Safe filters protect samples from X-ray over exposure. Specifically designed for your application to give total peace of mind for your devices. When selective sampling is utilized, IC-Safe shields completely eliminate radiation exposure to all other device samples not under test.
Panel Level Packaging
The Nordson XM8000-7P Pro is specifically designed for X-ray inspection of panel level packages with maximum panel size of 510mm x 515mm. Enabling manufacturers to identify even the smallest defects, buried inside multi-layer semiconductor panel level packages. The 7-axis system includes a detector gimbal for 3D capabilities which is the pinnacle of accuracy for fully automated X-ray metrology. The XM8000-7P Pro and EFEM has been upgraded to support wafer panels up to 510mm x 515mm in size. The system is designed to be tolerant to 6mm panel warpage and weights up to 3kg.