SE3000S 3D SPI
The new SE3000S™ 3D SPI system incorporates the industry leading MRS sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility.
Overview
The SE3000S™ 3D SPI system is the next level in solder paste inspection precision. Powered by industry-leading MRS sensor technology and improved resolution, it guarantees superior accuracy and consistency - even on the tiniest solder deposits. Combined with our award-winning, intuitive SPI software, the SE3000S™ is built for the most stringent quality standards.
For large-board applications, choose the SE3000S-X for maximum flexibility.
MRS Technology for 3D SPI
Nordson Test & Inspection’s Dual-Mode MRS PSX 189 Sensor for SPI provides the flexibility to use one mode for high speed inspection and another mode for high resolution inspection - all with one sensor.
Feedback, Feed Forward Ready
SE3000S fully supports feedback and feed forward capability with leading Solder Paste Printer and SMT Mounter vendors respectively. With simple configuration settings, SE3000S gives you the power to do more with SPI results - optimize printing process, establish stencil cleaning cycles and fine-tune printer setup. All this means reduced rework costs, increased production throughput and improved yields.
Superior Inspection Capabilities
Ideal for measuring height, area, volume, registration and bridging. Effectively detects insufficient paste, insufficient height, insufficient area, excessive paste, excessive height, smear, offset, shape height, deposit and customer defect types.
SPI Software
Nordson's SPI software delivers a world-class user experience with its intuitive interface that is extremely stable and simple to use, enabling the shortest learning curve. With a full multi-touch experience, SPI software offers a range of features that enable smarter and faster inspection.
Nordson Print Optimizer
Pre-defined templates help you get started quickly while customizable rules support perfect customization for specific product needs. The predictive process improvement gets you better yields and reduces downtime. Failure analysis drives line optimization and auto tolerance changes.
Improve Yields, Processes and Productivity