Stellar 4000 Bondtester
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
Overview
The high-quality frame is built to last, with a rugged design to ensure years of smooth operation. Industry Standard Production Bond Testing STELLAR 4000 incorporates Nordson core technology and is fully compatible with existing 4000 load cartridges. Use your existing or new load cartridges to guarantee accuracy, repeatability, and correlation: the system is designed for ultimate system-to-system consistency to always give you the same pass/fail results.
Specifications at a Glance
| Key Features | |
|---|---|
| Software | Paragon Lite |
| PC connection | Ethernet |
| Air supply safety | Tool protection & air warning |
| EMO switch position | Left keypad |
| Illumination | Software dimmable LED |
| Table type | Integrated & enclosed |
| Semiconductor Testing Standards | |
|---|---|
| Bump shear | JESD22-B117B JEITA-ET-7409 |
| Cold bump pull | JESD22-B115A JEITA-ET-7409 |
| Die shear | MIL-STD-883 IPC-TM-650 |
| Performance | |
|---|---|
| Step back accuracy | +/- 1 µm
|
| System accuracy | +/ - 0.25 % FSL |
| Axis travel (X x Y x Z) | 100 mm x 100 mm x 65 mm |
| XY speed and resolution | Up to 2 mm/s, 500 nm |
| Z speed and resolution | 5 mm/s, 250 nm |
| Semi Packing Testing Standards | |
|---|---|
| Ball bond shear | MIL-STD-883 ASTM-F129 JESD22-B116B |
| Wire pull | MIL-STD-883 IPC-TM-650 |
| Installation | |
|---|---|
| Footprint (W x D x H ) | 705 mm x 562 mm x 675 mm |
| Weight | 86 kg |
| Power supply | 100 - 240 VAC single phase |
| Pneumatic supply | Min 4.0 bar |
| Certification | |
|---|---|
| SEMI standards | S2 & S8 |
| CE compliance | Machinery, EMC & RoHS |
| Factory accreditation | ISO 9001:2015 |
| Environmental | ROHS (2011/65/EU) |
Industry Leading Precision
Maximum Operator Comfort
periods without risk to their health.
• Working heights, and controls designed with the operator in mind.
• Soft, padded arm rests ensure STELLAR 4000 is a pleasure to use.
• Antivibration optics, and dimmable lighting reduce eye strain during long sessions.
Perfect for Semiconductor
• Clean room friendly, enclosed design.
• Assessed to SEMI S2 environmental health and safety, and SEMI S8 ergonomic standards.
• Fast setup and intuitive ParagonTM
Lite software ensures you can release into production quickly.
Paragon Test Software
Extensive Testing Capability
Quick and Easy to Use
Training new operators is straightforward and follows a linear workflow. Paragon’s intuitive design ensures test set-up parameters are easily accessible with the start-up check list enabling a quick start. Its possible to have several access modes to allow setting modifications on-the-fly or if required, lock functionality so that operators can only access pre-saved test patterns.
Videos
Automated Bondtesting
Paragon Software
Hot Bump Pull Test
Cold Bump Pull
FAQ: Contact Reliability in High-Density Semiconductor Testing
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Q: Why is contact reliability so critical in modern semiconductor devices?
As semiconductor devices become smaller and more complex, the reliability of microscopic interconnects becomes essential to ensure consistent performance, safety, and long-term durability. Even minor defects can lead to significant failures over a product’s lifecycle.
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Q: What are interconnects in semiconductor devices?
Interconnects are tiny conductive pathways that enable signals, power, and data to flow between components. They form the backbone of every semiconductor device and are crucial for overall functionality.
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Q: How does miniaturization impact interconnect reliability?
Miniaturization reduces interconnect dimensions to just a few microns while increasing their density. This makes them more susceptible to variability in materials and manufacturing processes, increasing the risk of defects.
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Q: What is bond testing?
Bond testing is a method used to measure the mechanical strength of interconnects by applying controlled force. It provides quantitative insight into bond integrity and helps identify weak connections early in production.
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Q: How does bond testing differ from traditional inspection methods?
While inspection techniques detect visible or structural defects, bond testing evaluates the actual strength of interconnects, offering deeper insight into long-term reliability.
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Q: Why is bond testing considered a critical control point?
Bond testing directly verifies connection strength, helping manufacturers prevent field failures, improve product yield, and ensure devices meet reliability requirements over their entire lifespan.
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Q: What challenges do advanced packaging technologies introduce?
Advanced packaging methods such as FOWLP and 3D stacking introduce complex material interactions and stress variations, making it harder to maintain consistent bond quality and requiring more precise testing methods.
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Q: Why are automated bond testing systems important?
Automation improves measurement accuracy, repeatability, and throughput while reducing human error. It also enables better traceability and data-driven process optimization.
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Q: How is AI transforming bond testing?
Nordson Intelligence AI enhances bond testing by enabling faster and more consistent failure classification, identifying patterns in data, and helping detect process risks earlier in the production cycle.
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Q: What is the future of bond testing in semiconductor manufacturing?
Bond testing is evolving into an intelligent, data-driven process. Future systems will combine precision measurement, adaptive sampling, automation, and advanced analytics to support next-generation semiconductor technologies.
Resources & Downloads
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Brochures & Catalogs