Overview
NEXT GENERATION OF 3D PLANAR INSPECTION
As manufacturing requirements become ever more stringent, the capabilities and throughput of inspection solutions must continue to rise, to meet the demand and help manufacturers realise the ultimate goal of zero-defect parts. AXI Dynamic Planar CT is Nordson's superior software acquisition mode which improves yields. processes and productivity.
- Accelarate Acquisition - 2x faster than Planar CT
- Enhanced Data Quality - clear layer seperation
- Superior Reconstruction - brand new 3D algorithm
- Boosted UHP - dramatically increased throughput
- Larger FoV - increased coverage & shorter cycle times
- Lower Radiation Dosage - reduced time of exposure
- Reduced Complexity & CoO - no special clamping needed
Dynamic Planar CT
Planar CT
2D Transmission
Available across AXI Productportfolio
XS-Series
Applications
Semiconductor packages for wire, micro-BGA and flip chip bump inspection
A unique advanced algorithm library is available for the inspection of:
- QFN, TSOP, SSOP and memory chip gold or copper wire bonding (0.6mil) inspection.
- Micro-BGA, flip chip bump inspection down to 40micron bump inspection including multi-die inspection for micro-voids
X-Series
Applications
Electronic components and solder joint
A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes.
All standard SMD and THT/PTH components:
- BGA, LGA, POP, SIP, TSOP, QFN inspection.
- Defects like void, insu icient, bridge, HIP, missing, foreign material
X#-Series
Applications
Electronic components, solder joints and IGBT products
A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint on PCB and IGBT multi-layer void inspection.
- The SMT setup covers all standard SMD and THT/PTH components inspection BGA, LGA, POP, SIP, TSOP, QFN, etc. for defects like void, insufficient, bridge, HIP, missing, foreign material.
- The UHP setup covers all single DBC and multilayer IGBT products for voids on different soldering levels with an inhouse developed sophisticated algorithm for clear layer separation.