AMI SpinSAM Lite
Operator-Free Inspection and Analysis
The SpinSAM Lite automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer-based assemblies.
Overview
Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 2 wafers simultaneously with matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment.
Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.
Uniform, streak free images
Continuous water avoids trapping air resulting in streak free, uniform images as well as a clean operation with no moving parts above the scanner. With minimal water exposure, wafers are scanned and dried in place to decrease processing steps.
Full wafer scans take less than six minutes
A 100 μm scan (from wafer load to wafer load) takes less than six minutes. Wafers also enter and leave the system completely dry. The SpinSAM also includes a bar-coded reader for recipe verifications and uploads parameters, triggers calibration requests and historical records.