MX3000™ 3D AOI
The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS® Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.
MX3000™ 3D AOI
Overview
Multi-Reflection Suppression® (MRS®) Technology
MX3000™ offers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurements making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
Flexibility At Its Best
The MX3000™ 3D Automated Optical Inspection (AOI) system enables high resolution, dual-sided final vision inspection that doubles productivity. In-line multiple module grippers minimize handing tact time, and autoconversion supports various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM and others.)
Faster, Smarter Programming
With ultra-fast programming capabilities, auto tuning and other enhancements, CyberOptics’ AOI software significantly speeds set-up, simplifies the process, reduces training efforts and minimizes operator interaction.
Specifications at a Glance
| Inspection Speed | 50 cm2/sec (2D+3D) |
|
Board Length Board Width |
Min. 25 mm / Max. 140 mm Min. 17 mm / Max. 35 mm |
| Component Types Inspected |
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
| 3D Measurement inspection | Lifted lead, package coplanarity, polarity dimple and chamfer identification |
| Resolution | Sub 10 μm |
| Component Height Clearance (max) | 35mm |
| Solder Joint Defects Categories | Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more |
| Other Items Detected | Gold-finger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many others |