Overview:

Metrology Grade Accuracy
Attain highly accurate data with the industry-leading Multi-Reflection Suppression® (MRS®) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements. 

High Speed Inspection + High Resolution Inspection
Speed inspection with the MRS® sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed. The new Dual-Mode MRS sensor for the SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high speed inspection and another mode for high resolution inspection.      

Fast, Smart, Easy-to-use software 

Reduce training efforts and minimize operator interaction saving time and cost with the powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.
Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.
Improve yields and reduce downtime with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.
Improve yields with full-fledged machine-level to factory-level SPC capability.