Nordson DAGE

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4600-W Automated BondTester

Improve reliability and throughput while reducing human influence.

 

 

The 4600-W Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

 

 

 
 

 

 

Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.

Manual Testing BondtestingAutomated Bondtesting 4600-W

 

Repeatable results icon

 Repeatable Results Every Time

Increased ROI icon

 Improve Tool ROI

Our linear encoder stages with 100nm resolution ensure you get to the right location every time. Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.
Data is everything

 Data is Everything

Ultimate safety icon

 Ultimate Product Safety

 Achieve maximum data integrity with multiple on-board cameras to recognize fiducial markings and automatically capture failure mode images.  Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test.
Remove the Expert icon

 Remove the Expert

Max UPH icon

Maximum UPH

 Paragon™ software is easy to use and simple to set-up for a new product, meaning you don;t need to rely on expert operators as a single point of failure. A single operator can manage multiple systems if required.  Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the Bondtester.

 

Improved Data spread Graph Nordson DAGE

Applications:

Automatic testing for leadframe and wafers (<200mm)

electronics semiconductor wafer bondtest
                 


Paragon™ – Your automation partner

  • Automation assisted GUI
  • Build in check list & help
  • Multi window views
  • Schematic virtual images displayed

Paragon software display  Paragon software
       

Import maps or create your own

  • Import wafer map file SINF / G85 / Klarf (AOI) / New Format
  • Wire pull and ball shear pattern displays
  • Colour gradients indicate different heights
  • Inter-die wire corrections

 

map interference display wire pull pattern ball shear pattern interdie connector
 Map interface display  Wire pull pattern  Ball shear pattern  Inter-die wire connections
                                

Remove uncertainty - camera assisted programming

  • Ultimate accuracy using on-board cameras
  • Both high resolution and field of view cameras as standard
  • Fiducial images for alignment

 

Automatic fiducial recognition On board camera live images during testing High Resolution and FOV cameras
 Automatic fiducial recognition  On board camera live images during testing  High resolution and FOV cameras
                                                                                                                                                                     

Image every failure mode – even with extreme height variations

  • Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
  • Automatically return to the failure site to record an image
  • Assists with failure mode analysis
  • Comes as standard with every 4600 Bondtester

 

Compound surface imaging Bondtest CSI standard image DAGE CSI image
Compound surface imaging (CSI)  Standard image  DAGE CSI image
               
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