Nordson DAGE

Corporate | Global Directory | Languages

4600 Automated BondTester

Improve reliability and throughput while reducing human influence.

The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.


8 steps 4600 bondtester


 Battery  Wafer Level Micro-electronics
Battery wafer Micro electronics


4600 with cameras

Paragon™ – Your automation partner

  • Automation assisted GUI
  • Build in check list & help
  • Multi window views
  • Schematic virtual images displayed

Paragon software display  Paragon software

Import maps or create your own

  • Import wafer map file SINF / G85 / Klarf (AOI) / New Format
  • Wire pull and ball shear pattern displays
  • Colour gradients indicate different heights
  • Inter-die wire corrections


map interference display wire pull pattern ball shear pattern interdie connector
 Map interface display  Wire pull pattern  Ball shear pattern  Inter-die wire connections

Remove uncertainty - camera assisted programming

  • Ultimate accuracy using on-board cameras
  • Both high resolution and field of view cameras as standard
  • Fiducial images for alignment


Automatic fiducial recognition On board camera live images during testing High Resolution and FOV cameras
 Automatic fiducial recognition  On board camera live images during testing  High resolution and FOV cameras

Image every failure mode – even with extreme height variations

  • Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
  • Automatically return to the failure site to record an image
  • Assists with failure mode analysis
  • Comes as standard with every 4600 Bondtester


Compound surface imaging Bondtest CSI standard image DAGE CSI image
Compound surface imaging (CSI)  Standard image  DAGE CSI image

In This Section