Bondtesting Systems

 

 

Clean Room Compatible Wafer Bondtesters

4800 and 4800 INTEGRA™ The 4800 INTEGRA is the most advanced Bondtester on the market and is capable of fully in-line testing with robotic EFEM handler and OHT integration.

 

Fully Automated Bondtesters

4600-W Automated Bondtester The 4600-W Bondtester is a benchtop system designed to automatically perform complex wafer testing without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

4600 Automated Bondtester The 4600 Bondtester is designed to eliminate uncertainty by providing a robust fully automated testing solution. This bench top system achieves operator free testing by using a high accuracy stage and on-board camera’s. The system is proven to give ultimate reliability in Bondtesting results, and avoids the risk of human error. For complete accountability the system can be provided with benchtop handling systems for loading and unloading leadframes and wafers.

               

 

Micro Materials Testing

4000HS High Speed Tester Using high speed testing allows lead free solder analysis, impact testing and brittle fracture joint analysis. Standard Bondtesters cannot identify differences between lead and lead free solder, however, at high speeds differences are easily identified making the 4000HS an indispensable tool for lead free solder joint analysis.

                                                       

Micro Materials Tester Nordson DAGE has developed Paragon™ Materials, an innovative software platform designed specifically to perform and interpret a range of materials tests such as creep, torsion, fatigue, compression and bend.

           

 

Bondtesting Systems

4000PLUS Advanced Bondtester The 4000PLUS is designed for the most complex and challenging samples or where unique test types are required. This highly versatile system can cope with high forces while maintain maximum accuracy in both tool position and force measurements. These systems have unique features to deal with a range of industry testing such as stacked die in memory devices or combined wire pull/ball shear in LED’s.

                                                   

4000 OPTIMA Production Bondtester Optimized for production environments the 4000 OPTIMA is the fastest and most reliable Bondtester, while maintaining the accuracy needed for high throughput environments.

                                                   

4000 Series Bondtester The award winning and industry leading Bondtester has over 20 years of use in the market. By maximizing the ergonomics of the instrument layout and user interface, the 4000 Series is the most easy to use Bondtester on the market. Manual testing can be performed for hours while minimizing repetitive strain. The interface is a simple 1 button press and joystick movement meaning rapid tests can be undertaken be trained operators.