Nordson DAGE

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News

15 Nov 2018

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing.

04 May 2018

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Nordson DAGE 4800 Integra™ Automated Wafer Bondtester and Quadra™ 3 X-ray Inspection system win SMT China Vision and EM Asia Innovation Awards

Events

28-28 Mar 2019

Battery Tech Expo 2019

Telford, UK

Learn more about our solutions for Battery failure analysis 

7-9 May 2019

SMT Nuremburg 2019

Nuremburg, Germany

Nordson DAGE, MATRIX, SONOSCAN and YESTECH will be exhibiting their market leading Test and Inspection systems - Hall 4A - Stand 214

9-11 Jul 2019

Semicon West 2019

Moscone Center, San Francisco

View our Test and Inspection systems in Booth 5645