Nordson DAGE

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15 Nov 2018

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing.

04 May 2018

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Nordson DAGE 4800 Integra™ Automated Wafer Bondtester and Quadra™ 3 X-ray Inspection system win SMT China Vision and EM Asia Innovation Awards


7-9 May 2019

SMT Nuremburg 2019

Nuremburg, Germany

Nordson DAGE, MATRIX, SONOSCAN and YESTECH will be exhibiting their market leading Test and Inspection systems - Hall 4A - Stand 214

15-17 May 2019

NEPCON Korea 2019

Seoul, Korea

Visit Nordson DAGE with partner HumanTek and see our latest Test and Inspection Solutions - Booth #K112

9-11 Jul 2019

Semicon West 2019

Moscone Center, San Francisco

View our Test and Inspection systems in Booth 5645