Nordson DAGE

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15 Nov 2018

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing.

04 May 2018

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Nordson DAGE 4800 Integra™ Automated Wafer Bondtester and Quadra™ 3 X-ray Inspection system win SMT China Vision and EM Asia Innovation Awards


20-22 Mar 2019

Semicon China 2019

Shanghai, China

Visit us in Booth No. 3637, N3 to see the latest test and inspection equipment from Nordson DAGE, MATRIX and SONOSCAN

28-28 Mar 2019

Battery Tech Expo 2019

Telford, UK

Learn more about our solutions for Battery failure analysis 

7-9 May 2019

SMT Nuremburg 2019

Nuremburg, Germany

Nordson DAGE, MATRIX, SONOSCAN and YESTECH will be exhibiting their market leading Test and Inspection systems - Hall 4A - Stand 214