Nordson DAGE

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15 Nov 2018

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing.

04 May 2018

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Nordson DAGE 4800 Integra™ Automated Wafer Bondtester and Quadra™ 3 X-ray Inspection system win SMT China Vision and EM Asia Innovation Awards


3-5 Jul 2019

IPFA 2019

Grand Hyatt Hotel, Hangzhou

Visit our Booth to learn about Nordson DAGE and SONOSCAN test and inspection systems

9-11 Jul 2019

Semicon West 2019

Moscone Center, San Francisco

View our Test and Inspection systems in Booth 5645

27-29 Aug 2019

Nepcon South China 2019

Shenzhen, China

Visit the Nordson Advanced Technology Electronics Systems Booth at Nepcon South China - 1H20