Join our webinar series to learn how Nordson TEST & INSPECTION WaferSense® sensors can improve your semiconductor yields, processes and productivity.
The series features:
August 7: Auto Teaching System™ (ATS2) Wafer
August 14: Airborne Particle Sensor™ (APS) Wafer and Inline Particle Sensor™ (IPS)
August 21: Auto Multi Sensors™ (AMS & AVLS) Wafers
August 28: Auto Gapping System™ (AGS) Wafer
Continue reading to learn more and register for each webinar...
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August 7 - Auto Teaching System™ (ATS2) Wafer
The next webinar is Wednesday, August 7, 2024 featuring Auto Teaching (ATS2) Wafer
Two On-board image processors report x-y-z offset from the teaching wafer to a target inside the equipment so you can teach wafer transfer coordinates.
Register based on your time zone:
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August 14 - Airborne Particle Sensor™ (APS) Wafer and Inline Particle Sensor™ (IPS)
The APS technology enables equipment engineers to shorten equipment qualification, release to production and maintenance cycles, all while reducing expenses. Customers have experiences up to 88% time savings, up to 95% reduction in costs and up to 20X the throughput with half the manpower requirements by using the APS technology relative to legacy surface scan wafers.
Based on our WaferSense® Airborne Particle Sensor™ technology, IPS utilizes a high power blue laser to quickly monitor, identify and enable troubleshooting of particles as small as 0.1µm
Register based on your time zone:
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August 21 - Auto Multi Sensors™ (AMS & AVLS) Wafers
Semiconductor fabs and OEMs worldwide value the accuracy, precision and versatility of the WaferSense AMS – The most efficient and effective wireless measurement device for leveling, vibration and humidity.
Register based on your time zone:
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August 28 - Auto Gapping System™ (AGS) Wafer
Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. Improves uniformity, tool availability and repeatability.
Register based on your time zone:
什么是 WaferSense®
轻巧的、电池供电的、晶片状或十字形传感器
像标准晶圆一样在整个工具中运行（FOUP > LL > 工艺腔室等）
通过蓝牙或 WiFi 采集关键测量数据
提供精确、可靠且可重复的结果
启用实时测量、监控和高级功能基材
真空兼容–<10e-6 至 760 Torr (1 atm)
包含 CyberSpectrum 软件（提供无限量许可证和培训）
两个板载图像处理器报告从教学晶圆到设备内部目标的 x-y-z 偏移量，以便您可以教学晶圆转移坐标。
通过精确的晶圆交接校准，提高良率并降低颗粒污染。
实现可重复、可复现的半导体设备配置。
将设备使用时间从数小时缩短到数分钟。
通过目视检查加快故障排除速度并降低耗材费用。
我们期待您的光临！
联系诺信测试和检查
我们致力于帮助您找到符合您要求的检测和计量系统及传感器。