Join our webinar series to learn how Nordson TEST & INSPECTION WaferSense® sensors can improve your semiconductor yields, processes and productivity.
The series features:
August 7: Auto Teaching System™ (ATS2) Wafer
August 14: Airborne Particle Sensor™ (APS) Wafer and Inline Particle Sensor™ (IPS)
August 21: Auto Multi Sensors™ (AMS & AVLS) Wafers
August 28: Auto Gapping System™ (AGS) Wafer
Continue reading to learn more and register for each webinar...
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August 7 - Auto Teaching System™ (ATS2) Wafer
The next webinar is Wednesday, August 7, 2024 featuring Auto Teaching (ATS2) Wafer
Two On-board image processors report x-y-z offset from the teaching wafer to a target inside the equipment so you can teach wafer transfer coordinates.
Register based on your time zone:
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August 14 - Airborne Particle Sensor™ (APS) Wafer and Inline Particle Sensor™ (IPS)
The APS technology enables equipment engineers to shorten equipment qualification, release to production and maintenance cycles, all while reducing expenses. Customers have experiences up to 88% time savings, up to 95% reduction in costs and up to 20X the throughput with half the manpower requirements by using the APS technology relative to legacy surface scan wafers.
Based on our WaferSense® Airborne Particle Sensor™ technology, IPS utilizes a high power blue laser to quickly monitor, identify and enable troubleshooting of particles as small as 0.1µm
Register based on your time zone:
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August 21 - Auto Multi Sensors™ (AMS & AVLS) Wafers
Semiconductor fabs and OEMs worldwide value the accuracy, precision and versatility of the WaferSense AMS – The most efficient and effective wireless measurement device for leveling, vibration and humidity.
Register based on your time zone:
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August 28 - Auto Gapping System™ (AGS) Wafer
Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. Improves uniformity, tool availability and repeatability.
Register based on your time zone:
What is WaferSense®
Lightweight, battery-powered, Wafer-shaped or Reticle-shaped sensors
Travels like a standard wafer throughout the tool (FOUP > LL > Process Chamber, etc.)
Captures critical measurements via Bluetooth or WiFi
Provide precise, reliable and repeatable results
Enable real-time measurements, monitoring and advanced data logging
Vacuum compatible – <10e-6 to 760 Torr (1 atm)
Includes CyberSpectrum software (unlimited licenses and trainings available)
Two On-board image processors report x-y-z offset from the teaching wafer to a target inside the equipment so you can teach wafer transfer coordinates.
Improve yields and lower particulate contamination with accurate wafer hand off calibration.
Achieve repeatable and reproducible semiconductor equipment setups.
Reduce equipment downtime from hours to minutes.
Speed trouble-shooting and lower consumable expense with visual inspection.
We look forward to having you attend the event!
Contact Nordson Test & Inspection
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