Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 2 wafers simultaneously with matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment.

Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.