AXI X Series

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Overview


The X-platform series is a dedicated high speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment. The X Series platform is available with up to 4 advanced image acquisition modes, ensuring you have the optimal setup for all your applications and inspection requirements.


Acquisition Modes


The modular AXI system concept provides the unique capability to use several acquisition modes in one system.
Depending on the specific application request the optimum inspection technique can be selected and/or combined.

2D Transmission


Orthogonal two-dimensional imaging with moveable sample tray and a fixed detector position.

SFT Slice Filter Technique


Patented inspection technique for golden sample comparison and background removal for analysis.

Off-Axis Oblique Angle


Off-axis inspection (≤30°) via detector movement for high performance, oblique angle imaging.

Dynamic Planar CT


The next generation of high-quality 3D inspection, employing high-speed detector motion (3 sec/FoV).

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Advanced Hardware Technologies


  • High Speed AXI System for Inline configurations
  • Microfocus X-ray tube (sealed tube / maintenance free)
  • 5-axis programmable motion system
  • High-resolution, high-speed digital Flat Panel Detector
  • Low doese radiation filters for dose sensitive devices
  • Barcode scanner for serial number and product type selection
  • Full product traceability via customized MES-Interface

Highlights


  • Hardware setup dedicated to PCB inspection
  • High Speed setup for In-line pass through configuration
  • High oblique angle
  • Full traceability via MES and SECS/GEM interfaces
  • IPC-CFX-2591, IPC-Hermes-9852 and Industry 4.0 ready

Applications


Our proprietary advanced algorithm library provides comprehensive inspection of all standard surface mount devices, including BGA, LGA, PTH, THT, POP, SIP, QFN, QFP and TSOP.

SMD Solder Joint Inspection
Our sophisticated SMD inspections include solder coverage defect analysis for voiding, bridging, insufficient, missing, head-in-pillow, inside/outside meniscus, non-wetting, lifted lead, heal and toe, foreign material and shorting.

PTH Inspection
Our advanced algorithms also provide dedicated PTH defect inspection, including barrel fill, voiding, bridging, solder splash, bent pin and pin plugging.

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Nordson MIPS AXI Software Suite

X-ray Control - Tune - Verify - Image Browser


Next Gen Dynamic PCT

MIPS Software & Inspection Tools

  • 16-bit image processing
  • Automatic grey-level and geometric calibration
  • Teach&Go for fast and easy inspection creation
  • Proprietary advanced algorithm library
  • Machine learning based defect classification
  • Multi-layer slice extraction and analysis
  • Software based warpage compensation available

     
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Dynamic Planar CT

The next generation of 3D planar inspection
  • Accelerated Acquisition – >2× faster than Planar CT
  • Enhanced Data Quality – clear layer separation
  • Superior Reconstruction – brand new 3D algorithm
  • Greater UPH – dramatically increased throughput
  • Larger FoV – increased coverage & shorter cycle times
  • Lower Radiation Dosage – reduced time of exposure
  • Reduced Complexity & CoO – no specialized clamping needed

 

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Nordson SIGHT

Our new Statistical Process Control (SPC) package for AXI & AOI

  • Analyze – with defect data driven statistics & yield monitoring 
  • Visualize – with graphs, charts & CAD defect mapping
  • Evaluate – monitor KPIs in real time or over time with trend analysis
  • Report Out – extensive range of customized reporting options
  • Warning Notifications – alarms & alerts triggered by definable criteria 
  • Focus on what matters to you – customizable dashboard layout & content
  • Deep Dive – significantly more drill down functionality than available via MES

 

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Nordson INTELLIGENCE

Leverage Machine learning and AI reduce false calls

 

  • Increased Efficiency – significantly reduce overkill & thus operator workload
  • Greater Confidence – defect classification based on statistical probability (quantitative)
  • Better Consistency – reduced variation & subjectivity across operators & lines
  • Continuous Improvement – AI model refinement over time with additional data
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Dynamic Planar CT

Look past the Impossible. Superior Software for next generation of 3D Planar X-ray Inspection


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2D Transmission

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Planar CT

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Dynamic Planar CT

Resource & Downloads