Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at APEX
Minneapolis, Minnesota — February 2025 – Nordson Test & Inspection today announced plans to unveil advanced technology at IPC APEX Expo, scheduled to take place March 18-20th in Anaheim at booth #3200. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems, plus the advanced Nordson Intelligence ecosystem.
Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.
The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, advanced SMT, socket metrology, memory, mini/microLED, 008004/0201 solder paste and other next-generation applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions that are common with shiny components and specular surfaces. The SQ7000+ inspects for defects and measures critical parameters with a comprehensive coordinate measurement software suite.
The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities. The sensor provides 2D and 3D height measurements for high resolution inspection of various packaging such as wire bonds, including loop height measurement and related applications.
Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for Automated X-Ray Inspection (AXI) systems that reveals incredible details, significantly enhanced data quality, and clear layer separation with 3D reconstruction algorithms. The performance is significantly advanced with a larger field of view and an accelerated image acquisition that is 2X faster than Planar CT.
Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor and SMT applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revolution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.
Nordson’s superior lab-based Acoustic Micro-Imaging Inspection (AMI) system, the D9650™is powered by C-SAM® and designed with high-accuracy and maximum flexibility. The system is ideal for failure analysis, process development, material characterization and low volume production inspection for back-end semiconductor and SMT applications.
Visitors to the Nordson Test & Inspection booth at APEX can see demonstration of the latest next-generation inspection and metrology solutions that improve yields, process and productivity.
or more information, visit www.nordson.com/testinspect.
Inspection & Metrology Equipment
Our inspection & metrology equipment has been well received globally. Some of our most revered, world-class nondestructive solutions are featured below.
AMI SpinSAM - Scanning - Acoustic - Microscopy
Industry leading throughput on four 300mm wafer inspection Best in class footprint / UPH Leading defect capture and...
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SQ7000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology offers high resolution, high...
Learn moreAXI XS Series
Ultra High Resolution Inline AXI Platform 3D Inspection reveals incredible details for Nordson’s Zero Defects strategy....
Learn moreMXI QUADRA™ 7 Pro
Quadra™ Pro series creates unbeatable ultra high resolution images. The in-house designed, high performance Dual Mode...
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X-Plane technology provides high resolution, high magnification CT functionality anywhere on the board - without...
Learn moreSQ3000M2
Superior performance ideal for wirebond applications. SQ3000M2 automated optical inspection (AOI) ensures product...
Learn moreWaferSense® Auto Teaching System™ (ATS2)
Capture three dimensional offset data (x, y and z) to quickly teach wafer transfer positions.
Learn moreAMI Gen7
The New Generation of C-SAM Technology. The most sophisticated and fully featured C-SAM acoustic microscope for...
Learn moreWaferSense® Auto Gapping System 2™ (AGS2)
Improve Uniformity and Yield with the Wireless WaferSense AGS2 for Accurate and Repeatable Setups.
Learn moreAssure Component Counter
The correct material in the correct quantity at the right time in the right place. Ensure your production is smooth...
Learn more4000 Plus Bondtester
4000Plus bondtester sets the industry standard in bondtesting offering unsurpassed accuracy and repeatability of data,...
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The 003 Series Volume Metering Valve is a positive displacement meter valve that automatically dispenses a small,...
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