Nordson Corporation

Nordson Corporation

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NASDAQ $135.09   -3.73

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  • Our 2018 Annual Report is now available for viewing.

    Our 2018 Annual Report is now available for viewing.

    Download Report

  • Nordson's Q1FY19 Results Webcast will be broadcast on Thursday, February 21, 2019

    Nordson's Q1FY19 Results Webcast will be broadcast on Thursday, February 21, 2019

    Click here to register for webcast

  • Nordson Joins Partnership to Advance Innovation and Technology in Singapore

    Nordson Joins Partnership to Advance Innovation and Technology in Singapore

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  • Q & A With Anne Pombier, Recipient of “Women in Transactions” Award

    Q & A With Anne Pombier, Recipient of “Women in Transactions” Award

    Story

  • Applications are now being accepted for Nordson BUILDS Scholarships

    Applications are now being accepted for Nordson BUILDS Scholarships

    Learn More

  • Q&A on Nordson's New Women in Manufacturing Membership

    Q&A on Nordson's New Women in Manufacturing Membership

    Story

  • Nordson Renames Scholarship in Honor of Ken Kreeger

    Nordson Renames Scholarship in Honor of Ken Kreeger

    Story

  • Meet the Nordson BUILDS Scholars We Are Supporting This Year

    Meet the Nordson BUILDS Scholars We Are Supporting This Year

    Story

  • Nordson EFD introduces new product that drastically reduces plastic waste

    Nordson EFD introduces new product that drastically reduces plastic waste

    Story | Video

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Precision technology that touches your life every day everywhere.

Events

24-24 Feb 2019

Open Company Route - Open Bedrijven Route 2019 Deurne

  Beukeldijk 2, 5753 PA Deurne, The Netherlands 

Sunday February 24, Park Management Peelland and the Deurne municipality will organize an Open Company Route on the various business parks in Deurne (The Netherlands). Nordson also participates in…

4-6 Mar 2019

Sinopack 2019

Guangzhou, China

Booth : 2.2B45 

5-7 Mar 2019

IMAPS Device Packaging 2019

WekoPa Resort and Casino, Fountain Hills, Arizona USA

Nordson ASYMTEK presenting on underfill dispensing for chip-on-wafer and high-throughput jetting in micro-device packaging at iMAPS Device Packaging Conference.

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