Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at APEX
Minneapolis, Minnesota — February 2025 – Nordson Test & Inspection today announced plans to unveil advanced technology at IPC APEX Expo, scheduled to take place March 18-20th in Anaheim at booth #3200. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems, plus the advanced Nordson Intelligence ecosystem.
Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.
The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, advanced SMT, socket metrology, memory, mini/microLED, 008004/0201 solder paste and other next-generation applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions that are common with shiny components and specular surfaces. The SQ7000+ inspects for defects and measures critical parameters with a comprehensive coordinate measurement software suite.
The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities. The sensor provides 2D and 3D height measurements for high resolution inspection of various packaging such as wire bonds, including loop height measurement and related applications.
Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for Automated X-Ray Inspection (AXI) systems that reveals incredible details, significantly enhanced data quality, and clear layer separation with 3D reconstruction algorithms. The performance is significantly advanced with a larger field of view and an accelerated image acquisition that is 2X faster than Planar CT.
Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor and SMT applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revolution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.
Nordson’s superior lab-based Acoustic Micro-Imaging Inspection (AMI) system, the D9650™is powered by C-SAM® and designed with high-accuracy and maximum flexibility. The system is ideal for failure analysis, process development, material characterization and low volume production inspection for back-end semiconductor and SMT applications.
Visitors to the Nordson Test & Inspection booth at APEX can see demonstration of the latest next-generation inspection and metrology solutions that improve yields, process and productivity.
or more information, visit www.nordson.com/testinspect.
検査・計測機器
当社の検査・計測機器は、世界中で広く認められています。以下に、実績ある世界クラスの非破壊ソリューションの一部をご紹介します。
AMI SpinSAM - スキャニング - 音響 - 顕微鏡
4 枚の 300mm ウェーハ検査で業界をリードするスループット クラス最高の設置スペース / UPH 最先端の欠陥キャプチャと画像品質 メンテナンスが容易なモジュール式設計 工場とのコミュニケーションによる検査と分析の完全な自動化
詳細はこちらSQ7000+TM 3次元AOI、SPI、CMM用マルチファンクション
マルチ・リフレクション・サプレッション®（MRS®）センサー技術を搭載したSQ7000+マルチファンクションシステムは、高分解能、高精度、高速の検査・計測を提供し、AOI、SPI、CMMをインラインで実行できる市場で唯一のシステムです。
詳細はこちらMXI QUADRA™ 7 Pro
Quadra™ Pro シリーズ は、超高解像度の画像を作成します。社内設計の高性能 Dual Mode NT4 X 線管と Onyx 検出器で微細な部分まで詳細に可視化し、欠陥を直ちに検知します。もはやなにも隠せません。
詳細はこちらSQ3000M2
ワイヤボンドアプリケーションに最適な優れたパフォーマンス。 SQ3000M2自動光学検査 (AOI) により、製品品質 が最大化されます。 収量、プロセス、生産性を向上させ、現場からのコストのかかる返品を削減します。
詳細はこちらAMI Gen7 C-SAM®
新世代のC-SAMテクノロジー。 実験室での分析や特殊な高解像度アプリケーションのための、最も洗練されたフル機能のC-SAM音響顕微鏡です。 日本語のカタログは「お問合わせ」よりご請求ください。
詳細はこちら4000Plus
4000Plusは、ボンドテストの業界スタンダードに設定され、データの卓越した精度と再現性を提供し、結果に完全な信頼性を提供します。 日本語のカタログは「お問合わせ」よりご請求ください。
詳細はこちらX線コンポーネントカウンターを保証 - 私たちにお任せください
適切な時期に適切な場所に適切な量の適切な材料。 世界初のX線コンポーネント カウンターであるAssure™ を使用して、生産をスムーズに実行し、コスト効率を高めます。
詳細はこちらシンクタンク・ブログ最新情報
Nordson Test ＆& Inspectionソリューションについて詳しくご閲覧ください。業界や、新しい最先端の計測機器、検査装置について詳細を閲覧できます。