Thermal Interface Materials (TIM)
Non-silicone thermal compounds are widely used in electronic and electromechanical applications because they offer resistance to thermal cycling degradation. Our thermal compounds are formulated to provide excellent heat transfer, long shelf-life stability, and are RoHS and REACH compliant (lead-free).
Overview
Non-silicone thermal compounds are used in a wide range of electronic and electromechanical applications because they are resistant to thermal cycling degradation. Thermal compounds are formulated to provide excellent heat transfer. They are non-hazardous and are RoHS and REACH compliant (lead-free). Their long shelf-life stability ensures that they will not dry, harden, or melt in normal use.
Reference our Thermal Compound Selection Guide below for easy comparison of key characteristics of our most popular formulas. Individual formula data sheets highlight features and benefits along with technical details.
| SPECIFICATIONS | ||||||||||
| Formula | 52022 | 52050 | 52054 | 52055* | 52160 | 53053 | 53054 | |||
| Specific Gravity at 25° C | 2.7 | 2.6 | 3.0 | 2.8 | 2.6 | 2.8 | 3.0 | |||
| Bleed: 24 Hrs., % Weight | 0.1 | 0.01 | 0.01 | 0.01 | 0.3 | 0.5 | 0.01 | |||
| Evaporation: 150C, 24 Hrs., % Weight | 0.15 | 0.6 | <2.0 | 1.0 | 0.5 | 0.5 | <2.0 | |||
| Thermal Conductivity: W/m-K | 0.92 | 3.8 | 1.3 | 1.3 | 2 | 3.5 | 1.6 | |||
| Dielectric Strength: V/mil | 305 | 351 | 265 | 265 | n/a | 318 | 265 | |||
| Dielectric Constant: 25° C, 1000Hz | 4.5 | 4.92 | 5.02 | 5.02 | n/a | 5 | 5.02 | |||
| Dissipation Factor: 25° C, 1000Hz | 0.0029 | 0.0032 | 0.0022 | 0.0022 | n/a | 0.0027 | 0.0022 | |||
| Volume Resistivity: Ohm-cm | 1.65x10^14 | 1.0x10^13 | 2.0x10^15 | 2.0x10^15 | over current | 2.15x10^15 | 2.0x10^15 | |||
| Operating Temperature: ° C | -40 to 200 | -40 to 200 | -40 to 180 | 0 to 180 | -40 to 200 | -40 to 200 | -40 to 180 | |||
| Flow Rate: g/min | 4 to 7 | 1 to 3 | 8 to 9 | 4.5 to 6.5 | 3 to 8 | 7 to 9 | 5 to 6 | |||
| Minimum Bond Line: mm | 0.0381 | 0.0508 | 0.0127 | 0.0127 | 0.0254 | 0.1270 | 0.0127 | |||
| Viscosity: 25° C kCps | 460 | 350 | 470 | 620 | 230 | 1000 | 510 | |||
| Viscosity: 50° C kCps | 400 | 60 | 410 | 550 | 170 | 400 | 470 | |||
| Appearance | Smooth, off-white paste | Dark gray paste | Smooth white paste | Smooth white paste | Smooth, gray paste | Off white paste | Smooth white paste | |||
| Shelf Life | 1 year | 1 year | 1 year | 1 year | 1 year | 1 year | 1 year | |||
*Water cleanable for easy clean up
Mechanics of Heat Transfer
Choosing the best thermal compound requires some understanding of the mechanics of heat transfer and how the thickness of the thermal compound layer, the bond line thickness, influences product choice.
Bond Line Thickness
Bond line can be divided into three categories:
- Low, at less than 75 μm
- Medium, from 75 to 250 μm
- High, at greater than 250 μm
.
Conductivity and Resistance
Resources & Downloads
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Data Sheets & Guides
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Other Resources
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Videos
High-Performance Thermal Interface Material Overview
Our thermal compounds are formulated to provide excellent heat transfer, long shelf life stability, and are RoHS and REACH compliant (lead-free).
View more videos
Better Fluid Dispensing Blog
Our blog posts are here to help you learn more about the endless opportunities provided by innovative fluid dispensing systems. Discover new equipment, applications, and best practices for using fluid dispensers, to help improve your manufacturing processes.
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