SolderPlus Solder Paste
SolderPlus® dispense pastes are used where solder joints are needed but printing is not possible, and solder wire is neither practical nor efficient. Nordson EFD also offers a full line of printable solder pastes.
Overview
When solder joints are needed but printing is not possible and solder wire is neither practical nor efficient, our SolderPlus® dispense paste is the solution. As a global leader in dispensing solutions, Nordson EFD has developed a family of high-quality solder pastes specifically formulated for dispensing applications.
When paired with our benchtop dispensers, dispense valves, and robots, Nordson EFD solder pastes can provide a complete solution for your dispensing applications.
Benefits
- Available in no clean, RMA, RA, and water-soluble formulations
- Clog-free, top-to-bottom dispensing of the entire barrel
- Consistent deposit size
- Packaged in EFD’s syringe barrels for best dispensing performance
- No missed deposits
- Reliable batch-to-batch consistency
SolderPlus Print Paste
SolderPlus’s printable solder pastes are formulated for application on printed circuit boards through stencils. The dependable performance and wide process windows helps reduce manufacturing costs by increasing first-pass yields and reducing defects, rework, and rejects.
Printable solder pastes are available in a wide range of lead-free and leaded alloys and particle sizes, as well as many flux formulations, including no clean, RMA, and water soluble with halogen- and halide-free options.
Benefits:
- Long stencil life
- Consistent part quality with good print definition
- Reliable batch-to-batch consistency
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| Top SolderPlus Solutions | |
| Product Name | Product Description |
| NC 21 | NC 21 is optimized for dispensing applications. It is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as past flux. |
| NC 23 | NC 23 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. |
| RA 41 | RA 41 is a general-purpose RA formulation. IT is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as paste flux. |
| RMA 03 | RMA 03 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. |
| RMA 04 | RMA 04 is optimized for dispensing applications. It is available in dispensing solder paste and printing solder paste options. |
| WS 67 | WS 67 is a general purpose WS formulation. It is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as paste flux. |
| WS 70 | WS 70 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. |
| WS 71 | WS 71 is optimized for dispensing applications. It is formulated for high activity for soldering to stainless steel and many industrial applications. |
SolderPlus Selection Guide
Reference our Solder Paste Selection Guide to identify suitable alloy and flux options. Our product specialists can help you determine the best solution for your application, contact us at [email protected] for recommendations.
Available SolderPlus Options
Custom Formulations
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Solder to Stainless Steel
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Low-Temperature Lead-Free
Solder Paste Formulations
There are many possible options when formulating a solder paste. Nordson EFD’s general purpose solder pastes will meet most application requirements. For special requirements, EFD offers a range of specialized formulations. Please contact your Nordson EFD solder sales specialist for a free consultation.
| ALLOY TEMPERATURE GUIDE | |||||
| LEADED ALLOYS | LEAD-FREE ALLOYS | ||||
| Alloy | Solidus (° C) | Liquidus (° C) | Alloy | Solidus (° C) | Liquidus (° C) |
| Sn43 Pb43 Bi14 | 144 | 163 | Sn42 Bi57 Ag1.0 | 137 | 139 |
| Sn62 Pb36 Ag2 | 179 | 189 | Sn42 Bi58 | 138E* | |
| Sn63 Pb37 | 183E* | Sn96.5 Ag3.0 Cu0.5 | 217 | 219 | |
| Sn60 Pb40 | 183 | 191 | Sn96.3 Ag3.7 | 221E* | |
| Sn10 Pb88 Ag2 | 268 | 290 | Sn95 Ag5 | 221 | 245 |
| Sn10 Pb90 | 275 | 302 | Sn100 | 232MP** | |
| Sn5 Pb92.5 Ag2.5 | 287 | 296 | Sn99.3 Cu0.7 | 227E* | |
| Sn5 Pb95 | 308 | 312 | Sn95 Sb5 | 232 | 240 |
| Sn89 Sb10.5 Cu0.5 | 242 | 262 | |||
| Sn90 Sb10 | 243 | 257 | |||
| *Eutectic – Solidus and Liquidus are equal **MP – Melting point | |||||
| POWDER SIZE | ||||||
| Powder Type | Powder Size (micron) |
Gullwing Lead Pitch (mm / in) |
Square
/Circle Aperture (mm / in) |
Dispense Dot Dia. (mm/in) |
General Purpose Tip Gauge |
Tapered Tip Gauge |
| II | 45-75 µ | 0.65 / 0.025 | 0.65 / 0.025 | 0.80 / 0.030 | 21 | 22 |
| III | 25-45 µ | 0.50 / 0.020 | 0.50 / 0.020 | 0.50 / 0.020 | 22 | 25 |
| IV | 20-38 µ | 0.30 / 0.012 | 0.30 / 0.012 | 0.30 / 0.012 | 25 | 27 |
| V | 15-25 µ | 0.20 / 0.008 | 0.15 / 0.006 | 0.25 / 0.010 | 27 | |
| VI | 5-15 µ | 0.10 / 0.004 | 0.05 / 0.002 | 0.15 / 0.006 | 32 | |
Paste Features
Halide-Free
We offer a range of halide-free solder pastes that meet environmental trends and regulations.
Rapid Reflow
Our rapid reflow solder pastes will not spatter when heated and melted by solder, iron, induction, laser, hot bar, and other rapid reflow devices.
Pin Transfer and Dipping
Solder pastes that are applied by dipping a component or pin into the paste.
Low Residue
The quantity of flux residue left after reflow is less than with typical solder pastes.
Difficult-to-Solder Surfaces
Solder paste for difficult-to-wet metals such as Alloy42 lead finishes and highly oxidized surfaces of aged components and boards.
Gap Filling and/or Vertical Surfaces
The flux is designed to hold the alloy in place until liquidus is reached. These formulas are suited to bridging gaps, filling holes, and soldering joints on vertical surfaces.
Solder Paste and Flux Descriptions
To learn more about solder selection, the Clearly Understanding Solder Paste Descriptions blog offers and in depth guide to Nordson EFD solder solutions.
High-Performance Solder Paste
Nordson EFD offers ISO-certified SolderPlus solder dispensing paste for today's advanced electronics manufacturing, including stencil applications.
Resources & Downloads
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Data Sheets & Guides
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Literature
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Other Resources
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Videos
High-Performance Solder Paste Solutions
Nordson EFD offers ISO-certified SolderPlus® solder dispensing paste for today's advanced electronics manufacturing, PrintPlus® for stencil applications, and FluxPlus™ flux paste.
View more Solder videos
Better Fluid Dispensing Blog
Our blog posts are here to help you learn more about the endless opportunities provided by innovative fluid dispensing systems. Discover new equipment, applications, and best practices for using fluid dispensers, to help improve your manufacturing processes.
Halogens and Halides: Consider Halogen-Free Flux and Solder Paste
Jan 24, 2019Find out how halogen-free materials impact your manufacturing process.
Read More Halogens and Halides: Consider Halogen-Free Flux and Solder PasteFluid Dispensing 101: How to Fill a Syringe Barrel
Mar 31, 2020Find out how to properly fill a syringe barrel.
Read More Fluid Dispensing 101: How to Fill a Syringe BarrelFluid Dispensing 101: Syringe Barrel Selection
Feb 25, 2020Learn about more than five types of syringe barrels and their uses.
Read More Fluid Dispensing 101: Syringe Barrel Selection
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