Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson
Powertech Technology Inc. (PTI) Advances Underfill for Panel-Level Packaging with Nordson, Achieving Over 99% Yield
Powertech Technology Inc. (PTI), one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, has achieved over 99% yield in Panel-Level Packaging (PLP) using Nordson’s industry-leading ASYMTEK Vantage® Series fluid dispensing system and expert application support.
With the semiconductor industry pushing boundaries in AI, high-performance computing (HPC), and chiplet-based architectures, PLP is the next frontier for high-volume, cost-efficient processing of large-scale packages. But the transition from 300 mm wafers to panels isn't simple. Warpage, fluid flow limitations, and increased process complexity threaten yield and throughput.
Download the Full Case Study to Learn:
- How PTI optimized PLP processes for 515 x 510 mm panels for greater scalability
- How Nordson’s precision technology mitigated warpage and optimized fluid flow
- The techniques used to reduce cycle time by ~30% for greater efficiency
- The configuration and application details that achieved high-quality, void-free underfill results at scale
Ready to Scale Your Advanced Packaging Process with PLP?
Don’t let underfill challenges slow your progress. With Nordson’s precision PLP dispensing solution and expert applications engineering support, you can scale your advanced packaging applications with confidence.
Get the full case study and see how your team can achieve similar success.
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ASYMTEK Vantage® Series
Our most advanced dispensing platform. Designed for high-end semiconductor packaging and assembly.
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