Underfill Evolution

Without underfill, the life expectancy of a product would be significantly reduced due to the cracking of interconnects. This essential application has been around for many decades and is still going strong. Today’s underfill applications at the wafer, panel, and board-level are constantly evolving. As chip populations increase, dispensing applications must deliver smaller and smaller amounts of fluid with precision and consistency within small form factors and into micron-sized gaps between chips and components. And to advance throughput and yield, high-speed precise dispensing is crucial.

Is Your Underfill Application Keeping Pace?

With the Revisiting Underfill Handbook, you’ll learn about:

• Current underfill applications
• Application basics
• Capillary vs. molded underfill
• Essential process controls
• Advanced dispensing and jetting solutions for underfill applications

The handbook also includes the following tips and tools:

• The Underfill Volume and Tolerance Calculator
• Understanding cause and effect in the underfill process