A Novel New Approach to Acoustic Inspection using SpinSAM Technology

Check out the latest article in Semiconductor Digest titled "A Novel New Approach to Inspection using SpinSAM Technology."

Our multi-award-winning SpinSAM Acoustic Inspection system sets a new benchmark in the industry with its high throughput and superior sensitivity, enabling precise defect detection in wafer-based assemblies. Using an innovative spin-scanning method, the system scans up to four 300mm wafers simultaneously, achieving an impressive speed of 41 wafers per hour. This breakthrough scanning capability, combined with best-in-class defect capture and image quality improves yields, processes and productivity. Designed for 100% inspection, plus edge scanning that targets defect prone areas to optimize data acquisition where it is most needed. The system is an ideal solution for a wide range of semiconductor mid-end applications, including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers.

"In today’s semiconductor manufacturing industry – in particular the inspection process – there are clear and common productivity and quality control pre-requisites that rank high among the needs of manufacturers. If you’re one such company operating in the semiconductor production ecosystem, then it’s likely that your needs for inspection and testing will mirror those of others in the same industry. Higher throughput, greater accuracy in defect detection, higher resolution, smaller machine footprint and continuous uptime are all desired…"