Nordson's XS series - True Autonomous X-ray Inspection

High-Resolution and High-Speed Capabilities

XS series excels at identifying issues like damages wires, irregular flip chip bumps, voids in micro BGAs, and a wide range of defects in package-on-package components. This technology is a game changer in semiconductor inspection, offering unprecedented precision and efficiency, setting a new standard in the industry.

Thanks to the compact design and certified cleanroom capabilities, the XS system saves valuable floorspace and leaves more space for production.

Nordson's Team of in-house engineers continuously develop, build and pair all key components to ensure each system fulfils the exact requirements our customers and their rapidly changing designs present to us. 

MIPS in-house developed software enables true automatic inspection in 24/7/365 environments.