FluxPlus Paste Flux
Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more.
Overview
Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a wide array of formulations for use in a variety of applications.
Features & Benefits
- Controlled flux spread as a result of precise dispensing
- Holds small parts in place before soldering
- Delivers more flux compared to flux-core wire solder
- Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.)
- Convenient sizes: 10cc, 30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars
- Compatible with range of dispensing solutions, including jetting systems
FluxPlus Formulations
Flux categories are defined by Military Specification QQ-S-571E as well as the IPC flux rating system. There are five main categories in QQ-S-571E. Each is available with a variety of activity levels, physical qualities of their residue, and cleaning methods required.
| Dispensing Flux | Printing Flux | |||||||||
| Flux Type | RMA | RA | NC | WS | WS | WS | WS | RMA | NC | WS |
| Flux Class
J-STD-004B |
ROL0 | ROL1 | ROL1 | ORH1 | ORH1 | ORL0 | ORH1 | ROL0 | ROL1 | ORL0 |
| Formula | 07D00 | 41D00 | 21D00 | 71D00 | 72D00 | 63D00 | 67D00 | 08P00 | 27P00 | 45P00 |
| Aluminum | Non-solderable | |||||||||
| Beryllium Copper | ||||||||||
| Brass | ||||||||||
| Bronze | ||||||||||
| Cadmium | ||||||||||
| Chromium | Non-solderable | |||||||||
| Copper | ||||||||||
| Galvanized Steel | ||||||||||
| Gold | ||||||||||
| Kovar | ||||||||||
| Magnesium | Non-solderable | |||||||||
| Mild Steel | ||||||||||
| Monel | ||||||||||
| Nichrome | ||||||||||
| Nickel | ||||||||||
| Nickel Iron / Alloy42 | ||||||||||
| Nickel Silver | ||||||||||
| Palladium | ||||||||||
| Platinum | ||||||||||
| Silver | ||||||||||
| Solder Plated | ||||||||||
| Stainless Steel | ||||||||||
| Tin | ||||||||||
| Titanium | Non-solderable | |||||||||
| Zinc | ||||||||||
| Flux Types | Recommended Use | ||
| RMA | Rosin mildly activated | Recommended | |
| RA | Rosin activated | Wets clean surfaces | |
| NC | No clean | Alloy specific (contact EFD) | |
| WS | Water soluble | Not recommended | |
FluxPlus Families
No Clean (NC)
NC flux consists of rosin, solvent, and a small amount of activator. NC flux typically has low-to-moderate activity and is suited to easily solderable surfaces. IPC classification is usually ROL0 or ROL1. NC residue is clear, hard, non-corrosive, non-conductive, and designed to be left on many types of assemblies. Residue may be removed with an appropriate solvent. Some, but not all, NC fluxes are more difficult to remove than RMA fluxes.
Rosin (R)
R flux consists of rosin and solvent. Rosin flux has very low activity and is suitable only for easy-to-solder surfaces. IPC classification is ROL0. R residue is hard, non-corrosive, non-conductive, and may be left on. Residue may be removed with an appropriate solvent.
Rosin Mildly Activated (RMA)
RMA flux consists of rosin, solvent, and a small amount of activator. Most RMA flux is fairly low in activity and best suited to easily solderable surfaces. IPC classification is usually ROL0, ROL1, ROM0, or ROM1. RMA flux residue is clear and soft. Most are non-corrosive and non-conductive. Many RMA fluxes pass SIR testing as a NC flux. Residue may be removed with an appropriate solvent.
Rosin Activated (RA)
RA flux consists of rosin, solvent, and aggressive activators. RA flux has similar and higher activity than RMA for moderately and highly oxidized surfaces. IPC classification is usually ROM0, ROM1, ROH0, or ROH1. In the absence of testing to prove otherwise, RA flux residue is assumed to be corrosive. Assemblies sensitive to corrosion or the possibility of electrical conduction through the residue should be cleaned as soon as possible after assembly. Residue may be removed with an appropriate solvent.
Water Soluble (WS)
WS flux consists of activators, thixotrope, and solvent. WS flux comes in a wide range of activity levels, from no activity to extremely high activity for soldering to even the most difficult surfaces, such as stainless steel. IPC classification normally starts with OR for organic. They come in L, M, H activity levels and halide content of 0 or 1. By definition, residue may be removed with water.
Resources & Downloads
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Data Sheets & Guides
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Other Resources
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Videos
Applying Flux to a BGA Board with a Syringe
Nordson EFD's syringe applying flux to a BGA board.
View More EFD Videos
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