Solder White Papers

Solder White Papers


Air Powered Dispensing of Solder Paste
Nordson EFD explains the most critical variables affecting air-powered dispensing of solder pastes and outlines how to manage those variables to your advantage.

 

Auger Valve Dispensing
When tuned well, auger valves are capable of sub-milligram size deposits with less than 10% variability from deposit to deposit. When tuned poorly, a variety of problems can result, all of which can cause unacceptable deposit size variation.

 

First Principles of Solder Reflow
When it comes to reflow, it should be specific to what you are trying to accomplish with your product, not simply to duplicate a reflow profile.

 

Halides and Halogens. What do I need to know?
Halide-free materials are not new. Some segments of the electronics industry have been sensitive to halides and their significance for decades.

 

Tombstone Troubleshooting
While components and assemblies have become much smaller over time, overall assembly processes have remained much the same. As components become smaller, so can your process windows.