MXI Ruby XL
- Large Boards and Semiconductor Panel Level Packaging
- Inspection Area 840 x 615mm
- Option with high-resolution Onyx detector provides feature resolution down to 1.0 µm JIMA
Overview
The RubyXL supports exceptionally large sample sizes and high mass assemblies, making it ideal for inspecting oversized printed circuit board assemblies. Now enhanced with the Revalution software package, it delivers improved usability, superior image quality, and advanced 3D imaging performance.
With the optional high resolution Onyx detector, the RubyXL extends its capabilities to large format semiconductor applications—including glass and organic panel level packaging—achieving inspection resolutions down to 1 µm.
Sizes
- Maximum inspection area: 33” x 24.2” (840 x 615mm)
- 70° oblique angle views: 30” x 24” (762 x 610 mm)
- 360° full rotation around a point of interest
- Isocentric manipulator configuration keeps features in field of view
Advantages
- X-ray Source: NT 100 Maintenance Free – Sealed Transmissive
- Optional Aspire or Onyx detector
- 3D Imaging with X-Plane Pro
- Anti Vibration with AXIS- Active X-ray Image Stabilization
- Software: Revalution with optional AI feature upgrade
Crystal Clear X-ray Inspection
With the optional Onyx X-ray detector, delivering lower noise and higher resolution, increased inspection clarity can be achieved. The Revalution software package comes with optional upgrades including X-Plane for impressive 3D imaging, HDRlive image enhancement for clear defect visualisation and N-Intelligence AI inspection solutions for fast and accurate defect detection.
Resources & Downloads
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Brochures & Catalogs