STELLAR 4000 is extremely easy and comfortable to use so operators can test for prolonged
periods without risk to their health.
•   Working heights, and controls designed with the operator in mind.
•   Soft, padded arm rests ensure STELLAR 4000 is a pleasure to use.
•   Antivibration optics, and dimmable lighting reduce eye strain during long sessions.

STELLAR 4000 is designed specifically for the needs of semiconductor manufacturing.
•   Clean room friendly, enclosed design.
•   Assessed to SEMI S2 environmental health and safety, and SEMI S8 ergonomic standards.
•   Fast setup and intuitive ParagonTM
Lite software ensures you can release into production quickly.

Nordson's intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, such as automatic GR&R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting; increasing efficiency and providing 100% confidence in your bond testing results.

Paragon™ is designed using an efficient tab-based layout. Everything is easily accessible from a single layout with test settings fixed to a left hand column. An easy to access tool bar is available for the most commonly used features. Save, print, turn lights on, and even null the tool with a single click!

Training new operators is straightforward and follows a linear workflow. Paragon’s intuitive design ensures test set-up parameters are easily accessible with the start-up check list enabling a quick start. Its possible to have several access modes to allow setting modifications on-the-fly or if required, lock functionality so that operators can only access pre-saved test patterns.

Watch Nordson Bondtesting capabilities of a variety of bond and material tests including  shear, bend, peel, pull, creep and fatigue.

See how Paragon Bondtesting software allows users to simulate and edit their test patterns.

Our patented Hot Bump Pull (HBP) technology allows bondtested in a tensile mode on PCB assemblies.

The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process.