AXI XS Series
Ultra High Resolution Inline AXI Platform 3D Inspection reveals incredible details for Nordson’s Zero Defects strategy.
Dynamic Planar CT, is the superior software for next generation of 3D planar X-ray inspection which shoots AXI to the next level.
Overview
The XS Series provides a platform for inline or island automated X-ray systems covering a wide range of Automated X-ray Inspection (AXI) applications. With up to 4 advanced image acquisition modes, you have the optimum setup for all your applications and inspection requirements. Three dedicated system configurations serve the Semiconductor market:
Semiconductor - High-Resolution Wire Bond inspection.
Semiconductor Pro Strip - Ultra-High-Resolution Wire Bond and Flip Chip inspection.
Semiconductor Pro Tray - Ultra-High-Resolution Wire Bond and Flip Chip inspection with handling for JEDEC, steel and specialized carriers.
Acquisition Modes
The modular AXI system concept provides the unique capability to use several acquisition modes in one system.
Depending on the specific application request the optimum inspection technique can be selected and/or combined.
2D Transmission
SFT Slice Filter Technique
Off-Axis Oblique Angle
Dynamic Planar CT
Four In One - Advanced Technology
Advanced Hardware Technologies
- High speed AXI system with minimum footprint for inline setups
- Maintenance free, sealed microfocus X-ray source
- 5-axis programmable motion system
- High-resolution, high-speed digital Flat Panel Detector
- Low dose radiation filters for dose sensitive devices
Highlights
- Automatic barcode read and inspection selection
- Full traceability via MES and SECS/GEM interfaces
- IPC-CFX-2591, IPC-Hermes9852 and Industry 4.0 read
Applications
Wire Bond Inspection
Gold or copper wire bonding (≥0.6 mil) including stacked dies. Our advanced proprietary algorithm library includes specialized wire defect inspection for sweep, loop height, shorting, depressed, sagging, missing, broken, lifted wires, and lead frame deformation.
Solder Joint Inspection
Our defect detection capabilities also cover inspection of solder coverage, multi-die shift, rotation, voiding, foreign material checking and shorting.
Micro-BGA and Flip Chip Bump Inspection
Our sophisticated ball and bump defect algorithms include inspection for bridge, foreign material, deformed, tilted and missing balls, in addition to stacked die inspection for micro-voids
Nordson MIPS AXI Software Suite
X-ray Control - Tune - Verify - Image Browser
MIPS Software & Inspection Tools
- 16-bit image processing
- Automatic grey-level and geometric calibration
- Teach&Go for fast and easy inspection creation
- Proprietary advanced algorithm library
- Machine learning based defect classification
- Multi-layer slice extraction and analysis
- Software based warpage compensation available
Dynamic Planar CT
The next generation of 3D planar inspection- Accelerated Acquisition – >2× faster than Planar CT
- Enhanced Data Quality – clear layer separation
- Superior Reconstruction – brand new 3D algorithm
- Greater UPH – dramatically increased throughput
- Larger FoV – increased coverage & shorter cycle times
- Lower Radiation Dosage – reduced time of exposure
- Reduced Complexity & CoO – no specialized clamping needed
Nordson SIGHT
Our new Statistical Process Control (SPC) package for AXI & AOI
- Analyze – with defect data driven statistics & yield monitoring
- Visualize – with graphs, charts & CAD defect mapping
- Evaluate – monitor KPIs in real time or over time with trend analysis
- Report Out – extensive range of customized reporting options
- Warning Notifications – alarms & alerts triggered by definable criteria
- Focus on what matters to you – customizable dashboard layout & content
- Deep Dive – significantly more drill down functionality than available via MES
Nordson INTELLIGENCE
Leverage Machine learning and AI reduce false calls
- Increased Efficiency – significantly reduce overkill & thus operator workload
- Greater Confidence – defect classification based on statistical probability (quantitative)
- Better Consistency – reduced variation & subjectivity across operators & lines
- Continuous Improvement – AI model refinement over time with additional data
Resources & Downloads
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Brochures & Catalogs