AXI X# Series
High Flexible Inline AXI Platform with a wide range of inspection applications and three dedicated system configurations as UHP, SMT and FATP.
Overview
The X# Series provide an inline or island automated X-ray system platform, covering a wide range of Automated X-ray Inspection (AXI) applications, with three dedicated system configurations to serve the Ultra-High Power (UHP), Surface Mount Technology (SMT) and Final Assembly, Test and Pack (FATP) markets.
- UHP - Single DBC and multi-layer IGBT inspection
- SMT - PCB Solder Joint inspection
- FATP - Partially assembled, fully assembled or packaged electronic products inspection
The X# Series platform is available with up to 5 advanced image acquisition modes, ensuring you have the optimal setup for all your applications and inspection requirements.
Acquisition Modes
The modular AXI system concept provides the unique capability to use several acquisition modes in one system.
Depending on the specific application request the optimum inspection technique can be selected and/or combined.
SFT Slice Filter Technique
Off-Axis Oblique Angle
2D Transmission
Dynamic Planar CT
Advanced Hardware Technologies
- Flexible AXI system for inline and island of automation configurations
- Microfocus X-ray tube (sealed tube / maintenance free)
- 5-axis programmable motion system
- High-resolution, high-speed digital Flat Panel Detector
Highlights
- Low dose radiation filters for dose sensitive devices
- Automatic barcode read and inspection selection
- Full traceability via MES and SECS/GEM interfaces
- IPC-CFX-2591, IPC-Hermes-9852 and Industry 4.0 ready
Applications
Solder Joint Inspection
Our proprietary advanced algorithm library provides comprehensive solder joint inspection for all standard SMDs and a wide range of Power Hybrids including shunt resistors, capacitors, diodes and multi-layer IGBTs. These sophisticated inspections include solder coverage defect analysis for voiding, bridging, insufficient, missing, head-inpillow, inside/outside meniscus, non-wetting, lifted lead, heal and toe, foreign material and shorting.
Final Assembly, Test and Pack
Final product checking to evaluate assembly condition, absence of foreign material, presence of all required items and correctness of packing. Including mobile phones, wearables, personal audio and
portable computing devices (e.g. tablets and laptops).
Look Past The Impossible
Dynamic Planar CT
Look past the Impossible. Superior Software for next generation of 3D Planar X-ray Inspection
Nordson MIPS AXI Software Suite
X-ray Control - Tune - Verify - Image Browser
MIPS Software & Inspection Tools
- 16-bit image processing
- Automatic grey-level and geometric calibration
- Teach&Go for fast and easy inspection creation
- Proprietary advanced algorithm library
- Machine learning based defect classification
- Multi-layer slice extraction and analysis
- Software based warpage compensation available
Dynamic Planar CT
The next generation of 3D planar inspection- Accelerated Acquisition – >2× faster than Planar CT
- Enhanced Data Quality – clear layer separation
- Superior Reconstruction – brand new 3D algorithm
- Greater UPH – dramatically increased throughput
- Larger FoV – increased coverage & shorter cycle times
- Lower Radiation Dosage – reduced time of exposure
- Reduced Complexity & CoO – no specialized clamping needed
Nordson SIGHT
Our new Statistical Process Control (SPC) package for AXI & AOI
- Analyze – with defect data driven statistics & yield monitoring
- Visualize – with graphs, charts & CAD defect mapping
- Evaluate – monitor KPIs in real time or over time with trend analysis
- Report Out – extensive range of customized reporting options
- Warning Notifications – alarms & alerts triggered by definable criteria
- Focus on what matters to you – customizable dashboard layout & content
- Deep Dive – significantly more drill down functionality than available via MES
Nordson INTELLIGENCE
Leverage Machine learning and AI reduce false calls
- Increased Efficiency – significantly reduce overkill & thus operator workload
- Greater Confidence – defect classification based on statistical probability (quantitative)
- Better Consistency – reduced variation & subjectivity across operators & lines
- Continuous Improvement – AI model refinement over time with additional data
Resources & Downloads
-
Brochures & Catalogs