Application & Set Ups
Semiconductor Backend and Solder Joint Inspection
Assembly and Non-destructive Test
Selling Solutions
Beside high-speed Autonomous Inline X-ray Inspection Nordson AXI supplies additionally manual, semi-automated and automated inspection solutions for non-destructive testing (NDT) of other non-electronic materials, such as casting or medical parts, by using X-ray or computer tomography (CT) technology.
Semiconductor Backend
LED
Sensor X-ray inspection is mainly covered from the SMT solder-joint algorithm library. In respect of voiding in the sensor joint area – a dedicated advanced void algorithm is available. For wire-bond inspection the semi-back end algorithm library can be used. Sensor inspection in multi-panel board condition can be inspected with the standard SMT setup in all MXI and AXI systems. De-panelized sensor components are inspectable in trays as well. For such application a specific component in tray handling is available (XS3). Typical LED Inspection Coverage:
Off-position
Insufficient soldering
Lifted
Voiding
Wire-bond test
AXI Systems X# & XS
Wire-Sweep Bondtest
Autonomous X-ray inspection solutions for semiconductor application on substrate-level (component backend)
Manual X-ray analyser plays an important role in the inspection of semi-conductor devices for sampling and/or quality control.The new X2.5# series is now first time capable to allow a 100% all wires on substrate inspection.The new Nordson AXI wire sweep algorithm library allows a fully automatic inspection on the wire sweep profile – based on CAD input and chip model library.
First wire-sweep AXI for 100% inspection (automotive components requirement).
AXI Systems X# & XS
Sensors
Various sensor AXI applications are available from Nordson with dedicated inspection algorithms. Especially in the automotive and aerospace area critical sensors have to be 100% inspected and therefore high-speed AXI is required with cycle-times less then 5s (3s) per sensor. Currently 2 different system setups are available: Sensor in tray setup (X2.5#, X3S) and dedicated integrated inline solutions with customized sensor holders and the capability to rotate the sensor for different angle-shots.
Available standard solutions:
Airbag initiator inspection coverage:
Assembly & placemment test
Powder filling level
Wire soldering inspection
Missing & broken wires
Pressure-sensors (ABS) inspection coverage:
Assembly & placement test
Material welding test
Wire shape test
Missing & broken wires
Customized solutions upon request.
AXI Systems: X#
Solder Joint Inspection
Solder Joint Inspection
X-ray inspection for solder joint analysis is an integral part in quality control of today’s electronic production. Especially packages like BGA and QFN, processed with hidden solder joints, require X-ray solutions to ensure product quality.
Inspection coverage (extract):
Lifted
Insufficient
Voiding
Head-in-Pillow (HIP [BGA])
Bridge/short
Nordson's AXI offers a comprehensive algorithm library for state of the art defect recognition throughout all SMT capable system types. It can typically be used for 100% test coverage (all components) inspection or for selective parts only (BGA,QFN) in on-line or off-line setups.
Combined Inspection Technologies: Transmission (2D), 2.5D and/or 3D technique.
AXI Systems: X# & XS & X
Power Devices/Cooling Plates
Analysing voiding and soldered area of assembled power devices and cooling plates. Special solder-level separation technique for multi-layer soldering applications (hybrid-power components).
Inspection coverage (extract):
Voiding [%]
Voiding (area)
Void-separation for multi-layer (i.ex. for chip-layer and substrate layer)
Soldering area
Requires high power setup and 16 Bit detector technology for heavy cooling plates. By using the Nordson SFTTM Technology - inhomogeneous backgrounds and disturbing structures are eliminated, thus assuring a correct void calculation.
AXI Systems: X & X#
PTH
Wetting coverage of Pin-Through-Hole (PTH) connections is an essential test of post-wave and/or post-selective soldering processes. In conjunction with Nordson AXI 2.5D oblique-view image capturing techniques and best in class THT/PTH algorithm library, a tailored high-speed solution can be provided.
Inspection coverage (extract):
Barrel fill
Pin penetration
Voiding
Bridge/Short
Solder balls
For automotive applications typically 100% inspection for all PTH required.
AXI Systems: X#
Assembly Test
Subassemblies
Components range from power transmission through interior trim to electronics. Materials may be metallic or non-metallic, but in either case Nordson’s experience in the sector is to assist the demand of manufacturers in:
Inspection of hidden components
PTH Inspection
Void Inspection
Inspection of discrete elements
AXI Systems: X#
Final Assembly Test (Consumer)
Best in class final assembly inspection for complete electronic products such as smart phones, notebooks, wearables etc.
Inspection coverage (extract):
Integrity: extra and missing components/material (e.g. screws)
Missaligned components and modules (e.g. cables, connectors, screws)
Connector alignment check
Comprehensive screw test (e.g. loosen, missing, tilted screws, tightness)
Inspection via high speed X-ray line scan technique and/or multiple image capturing using latest flatpanel-detectors.
AXI Systems: X#
Power Adapter
Final assembly inspection of power adapters and connectors.
Inspection coverage (extract):
Assembly offsets
Soldering quality
Detection of cracks in power springs
Inspection via high speed X-ray line scan technique and/or multiple image capturing using latest flatpanel-detectors.
AXI Systems: X#
Non-Destructive Test
Batteries
Advanced battery form factors require smart inspection techniques for:
Anode-Cathode-Offset check
Ensuring size accuracy of all layers
Nordson's fully automatic CT capturing and resulting 3D-slice-analysis lifts that task from the lab to the actual production floor. Enabling real time process control with automised feedback loops.
AXI Systems: X#
Casting/Advanced Materials
Automatic material analysing under in-line production conditions with a highly precise and industry leading automatic registration technique. Especially safety relevant casting parts used in the automotive industry are often required to be inspected:
Inspection coverage (extract):
Blowholes
Porosity
Inclusions
Cracks
Object contour-filtering for ease-to-use defect navigation.
AXI Systems: XCT
Medical Implants
Automatic 2D X-ray and CT inspection of critical medical parts such as screws, nails and other implants.
Inspection coverage (extract):
Size and type accuracy inspection
Integrity of the packaging/
Based on the actual task the most suitable imaging technique can be selected out of Nordson complete image capturing portfolio.
AXI Systems: X#