Mid End Semiconductor

View SpinSAM Product

This advanced system sets a new benchmark in the industry with its high throughput and superior sensitivity, enabling precise defect detection in wafer-based assemblies. Using an innovative spin-scanning method, the system scans up to four 300mm wafers simultaneously, achieving an impressive speed of 41 wafers per hour. This breakthrough scanning capability, combined with best-in-class defect capture and image quality, enhances both productivity and accuracy in semiconductor inspection. Designed for 100% inspection, as well as edge scanning that targets defect prone areas, optimizing data acquisition where it is most needed. This makes it an ideal solution for a wide range of semiconductor mid-end applications, including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers.