Welcome to the future of semiconductor packaging!

At Nordson, we're committed to pushing process boundaries. We design our solutions to keep pace with the semiconductor industry's evolving needs, delivering topline cost of ownership with higher throughput, yield, reliability, and cost-efficiency.

First discussed within the industry in 2016, panels offer new possibilities for processing more and larger package sizes that involve heterogeneous integration, chiplets, and 3D packaging. Lower packaging cost and higher throughput and yield are the primary benefits of panel-level packaging. Panel formats also offer environmental advantages such as reduced waste and carbon footprint, which are critical factors in advancing sustainability.

Our panel-level solution solves key process challenges and is powered by the industry-leading ASYMTEK Vantage® Series precision fluid dispensing system, IntelliJet® Jetting system, and next-generation Canvas® fluid dispensing to support your process.

What's Inside the Brochure?

• Explore why managing warpage and heat uniformity are so critical in panel-level applications
• Get an overview of the ASYMTEK Vantage® Series panel-level process solutions and capabilities
• Get an overview of the ASYMTEK Vantage® Series wafer-level process solutions and capabilities

Ready to scale your packaging process?

Get the Brochure

Join the leaders in the semiconductor industry who trust Nordson for their advanced packaging applications.

System

Panel Level Package VS Wafer

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