Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
What if your semiconductor inspection process could be faster, smarter, and more precise? Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, reveals how 3D X-ray innovations are making that a reality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
检测和计量设备
我们的检测和计量设备在全球得到广泛认可。以下是我们的一些经过验证的世界级非破坏性解决方案。
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