4000 Plus Bondtester
4000Plus bondtester sets the industry standard in bondtesting offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.
Overview
The second generation Nordson TEST & INSPECTION 4000Plus is the most advanced bondtester on the market. Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.
The 4000Plus multi-purpose bondtester performs shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and micro materials tests. This system is also ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.
Specifications at a Glance
| XY Stages | |||
|---|---|---|---|
| Work Surface Type | Recommended Shear Application | XY Travel | Max. Y force |
| High Speed | Zone shear up to 25 kg @ 50 mm/s or 50 kg @ 25 mm/s | 160 x 160mm | 50 kg |
| High Force | Die shear up to 200 kg @ 0.7 mm/s | 160 x 160mm | 200 kg |
| High Precision | Ultra fine pitch ball shear up to 10kg @ 0.7 mm/s | 210 x 300mm | 10 kg |
| Z-Axis and Working Envelope | |
|---|---|
| 4000Plus-Mainframe | 75mm Z-axis travel; 120mm working envelope |
| Specifications | |
|---|---|
| Footprint | W = 630mm (including left and right joysticks), D = 600mm, H = 830mm |
| Weight | 90kg including XY table |
| Power Supply | 90- 264VAC single phase |
| Pneumatic Supply | 4 bar minimum, 6mm OD plastic pipe. Note some specialized applications may require increased pressure, clean dry air |
| Vacuum Supply | 500mm Hg (67kPa) minimum, 6mm OD plastic pipe |
| Accuracy | |
|---|---|
| Total system accuracy using load cartridges | +/- 0.1% full scale deflection for selected load range (see detailed load cell specifications) |
| Shear (ball and die) load cartridge step back accuracy (excl. S25) | +/- 1μm over 2mm of travel in Z-axis |
| S25 step back accuracy | +/- 0.25μm over 2mm of travel in Z-axis |
Wide Range of Optical Solutions
Highly Versatile
Switch Applications in Just Seconds
Extensive Testing Capability
Featured Applications
Ribbon pull – With an extensive range of load tools including hooks and tweezer jaws, all sizes and types of ribbons can be tested.
Hot bump/pin pull – A new load cartridge makes this groundbreaking test even better, especially for evaluating PCB substrate materials and low profile solder bumps.
First bond ball pull of copper wires and pull of studs, bumps and pillars – For the first time custom pull jaws enable tensile tests on these important interconnects.
Passivation layer shear – A combination of software and a special load tool provides a solution to ball shear where access is limited by the passivation layer.
Increased Efficiency
Image Capture Camera
High Speed Camera
Trinocular Camera
FAQ: Contact Reliability in High-Density Semiconductor Testing
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Q: Why is contact reliability so critical in modern semiconductor devices?
As semiconductor devices become smaller and more complex, the reliability of microscopic interconnects becomes essential to ensure consistent performance, safety, and long-term durability. Even minor defects can lead to significant failures over a product’s lifecycle.
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Q: What are interconnects in semiconductor devices?
Interconnects are tiny conductive pathways that enable signals, power, and data to flow between components. They form the backbone of every semiconductor device and are crucial for overall functionality.
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Q: How does miniaturization impact interconnect reliability?
Miniaturization reduces interconnect dimensions to just a few microns while increasing their density. This makes them more susceptible to variability in materials and manufacturing processes, increasing the risk of defects.
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Q: What is bond testing?
Bond testing is a method used to measure the mechanical strength of interconnects by applying controlled force. It provides quantitative insight into bond integrity and helps identify weak connections early in production.
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Q: How does bond testing differ from traditional inspection methods?
While inspection techniques detect visible or structural defects, bond testing evaluates the actual strength of interconnects, offering deeper insight into long-term reliability.
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Q: Why is bond testing considered a critical control point?
Bond testing directly verifies connection strength, helping manufacturers prevent field failures, improve product yield, and ensure devices meet reliability requirements over their entire lifespan.
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Q: What challenges do advanced packaging technologies introduce?
Advanced packaging methods such as FOWLP and 3D stacking introduce complex material interactions and stress variations, making it harder to maintain consistent bond quality and requiring more precise testing methods.
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Q: Why are automated bond testing systems important?
Automation improves measurement accuracy, repeatability, and throughput while reducing human error. It also enables better traceability and data-driven process optimization.
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Q: How is AI transforming bond testing?
Nordson Intelligence AI enhances bond testing by enabling faster and more consistent failure classification, identifying patterns in data, and helping detect process risks earlier in the production cycle.
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Q: What is the future of bond testing in semiconductor manufacturing?
Bond testing is evolving into an intelligent, data-driven process. Future systems will combine precision measurement, adaptive sampling, automation, and advanced analytics to support next-generation semiconductor technologies.
Resources & Downloads
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