Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at APEX

Nordson Test & Inspection

févr. 28, 2025

Minneapolis, Minnesota — February 2025 – Nordson Test & Inspection today announced plans to unveil advanced technology at IPC APEX Expo, scheduled to take place March 18-20th in Anaheim at booth #3200. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems, plus the advanced Nordson Intelligence ecosystem.

Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.

The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, advanced SMT, socket metrology, memory, mini/microLED, 008004/0201 solder paste and other next-generation applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions that are common with shiny components and specular surfaces. The SQ7000+ inspects for defects and measures critical parameters with a comprehensive coordinate measurement software suite.

The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities. The sensor provides 2D and 3D height measurements for high resolution inspection of various packaging such as wire bonds, including loop height measurement and related applications.

Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for Automated X-Ray Inspection (AXI) systems that reveals incredible details, significantly enhanced data quality, and clear layer separation with 3D reconstruction algorithms. The performance is significantly advanced with a larger field of view and an accelerated image acquisition that is 2X faster than Planar CT.

Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor and SMT applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revolution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.

Nordson’s superior lab-based Acoustic Micro-Imaging Inspection (AMI) system, the D9650™is powered by C-SAM® and designed with high-accuracy and maximum flexibility. The system is ideal for failure analysis, process development, material characterization and low volume production inspection for back-end semiconductor and SMT applications.

Visitors to the Nordson Test & Inspection booth at APEX can see demonstration of the latest next-generation inspection and metrology solutions that improve yields, process and productivity.

or more information, visit www.nordson.com/testinspect.

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