Leading IC Manufacturing Provider Achieves 99.66% Yield for CoW Underfill with Nordson

Underfill material is used in Chip-on-wafer (CoW) processes to bond chips directly to a wafer, minimizing stress on solder joints and offering thermal and mechanical stability that protects the package. Cost reduction and miniaturization demands challenge the CoW underfill process exponentially.
Learn how this IC manufacturing and technology services provider increased CoW yield by 3.3% from 96.47% to 99.66% with Nordson to advance their customer’s underfill application.

Case Study:

Leading IC Manufacturing Provider Achieves 99.66% Yield for CoW Underfill with the Forte® Series and IntelliJet® Jetting System.