Leading Global Semiconductor Manufacturer Surpasses 99% Yield with Nordson

In the fast-paced world of semiconductor manufacturing, achieving and surpassing yield targets is critical to maintaining a competitive edge. This case study reveals how we partnered with a global semiconductor leader to exceed a 99% yield in their capillary underfill application.

Discover How We Did It:

Precision Fluid Dispensing: Leveraging cutting-edge technology, we delivered precise dispensing, process control, and uniformity to ensure structural integrity, electrical connectivity, and stability under thermal cycling and mechanical stress.

Advanced Plasma Surface Treatment: Our plasma surface treatment technology was instrumental to the success of this application. It eliminated conductive flux residue before the precision dispensing process to prevent voids and unintended electrical paths between the solder connections that negatively impacted yield.

Case Study

Ready to dive deeper? Download the full case study to explore the technical details, process optimizations, and how our innovative solutions can help your application reach new heights.

Why Partner with Us?

With years of experience in precision fluid dispensing and plasma surface treatment, we have the expertise to tackle the most complex application challenges. Our commitment to innovation and quality ensures we deliver solutions that meet and exceed your expectations.