MXI Jade Plus

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MXI Jade Plus

X-ray Inspection for electronics assembly

Overview


Restrictions in manufacturing materials and ever increasing expectations for reliability mean ensuring quality product manufacture is more important than ever. Jade Plus enables you to Prove Your Quality and reduce product returns from the field, and the associated cost and damage to reputation.

 

Prove Your Quality

Jade Plus inspects the hidden regions of your products which are inaccessible to optical tools.

  • Spot quality process trends early using advanced measurement tools for distance measurement and voiding.
  • Ensure IPC-A-610 and IPC-7095 compliance with built in checking for BGA and QFN voiding, solder ball diameter, roundness, bridge and missing.
  • See assembly defects clearly with 0.95 µm image resolution. 

 

JadePlus-Solder Pad Defects-2022

Screen for solder pad defects quickly with automated voiding measurement.

JadePlus-Component Location Feature-2022

See what you are inspecting and move to parts quickly with the Component Location feature.

Specifications at a Glance


X-ray Tube | Open Transmissive
Feature recognition 0.95 µm
Tube target power
3 W
Voltage 30 - 160 kV
Detector | AspireFPTM Flat Panel Detector
Resolution 1.33 MP
Frame Rate 10 fps
Digital image processing 16 bit
Inspection
Software Gensys® X-ray Inspection Software for Windows 10
Operation Mouse point-and-click (joysticks optional)
Oblique angle view 2 x 65° - 360° around point of interest
Inspection area 510 x 445 mm (20 x 17.5")
Magnification Up to x 7,500
Display Single 24" WUXGA, 1920 x 1200
Installation
Footprint (W x D x H) 1.45 x 1.70 x 1.97 m
Weight 1,950 kg (4,300 lbs)
Air Supply Not required
X-ray safety < 1 µSv / hour, Meets all international standards

Prove Your Quality


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Measurement


Jade Plus gives a unique insight into your product quality. Advanced measurement functions, included as standard, turn X-ray images into quantitative data that you can use to spot emerging quality trends early, before it’s too late.

Compliance


In-built tools for dimension measurement, BGA void analysis, bump diameter and roundness and through hole filling make quick work of finding and characterizing defects, helping you achieve IPC-A-610 and IPC-7095 compliance.
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Advanced Technology


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Fast Throughput


Enjoy high throughput even with a high mix of products.

  • Save time inspecting multiple boards. Program an automated inspection routine once, then load, click and go.
  • See from every side at high magnification. Nordson DAGE’s unique double angle geometry does not rotate the board so you never lose orientation.
  • Click to jump directly to a specific part. Component Location uses board design data so you always know what you are looking at.

Open Tube Technology


Jade Plus features an open X-ray tube with a replaceable tungsten filament.

  • Designed with maintenance in mind so you can be up and running fast, whenever the filament defocuses or expires.
  • Tungsten filaments fade over time, however you can experience ‘as new’ performance at any time by swapping in a new filament.
  • Training included, to minimize the risks of contaminating or damaging the X-ray tube during filament changes.

For a maintenance free alternative, consider Quadra® 3 which requires no filament changes, ensuring ‘as new’ uninterrupted performance for life.

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Never lose your way


To prove your quality with confidence you need the highest quality tools.

Easy Navigation


See what you are inspecting and move to parts quickly with the Component Location feature.

Automated Inspection Routines


See what you are inspecting and move to parts quickly with the Component Location feature.

Split Screen


4-way split screen view makes it easy to compare components and evaluate views from different angles.

0.95µm Resolution


3D visualization of BGA solder balls using optional µCT accessory.

Resources & Downloads


  • Brochures & Catalogs