How to Optimize Your Plasma Application to Remove Oxidation from Copper Lead Frames
Jan
31,
2023
Copper alloy, a common substrate material in IC packaging, provides good thermal and electrical performance, sound manufacturability, and is cost-effective. But it has a high affinity to oxygen, which can cause oxidation and, as a result, delamination that can affect product reliability.
A plasma application with optimized process parameters, gas chemistry, and electrode configuration can increase the rate of oxide removal, limit surface discoloration, minimize process time, lower the risk of overtreatment and heat-related issues, and improve throughput and yield.
A plasma application with optimized process parameters, gas chemistry, and electrode configuration can increase the rate of oxide removal, limit surface discoloration, minimize process time, lower the risk of overtreatment and heat-related issues, and improve throughput and yield.
In this paper, you will learn:
- Why process parameters and equipment matter
- How to use gas chemistry to improve results
- How to choose the ideal electrode configuration