Overview

Features and Benefits

• Measures board warpage and downward deflection of the circuit board during preheating
• The board warpage sensing system eliminates the need for labor-intensive manual adjustment of the soldering program
• Easy setup significantly minimizes operator interface reducing the possibility of human error and shortening programming time
• The Board Warpage sensing system utilizes laser-based measurement technology requiring minimal preventative maintenance
• The Board Warpage Sensing system is an available optional feature on Cerno^® 508.1, Integra^® 508.2, 508.3, 508.4, and 508.5 models

Overview. The Board Warp Sensing system measures the height differences of a printed circuit board assembly as it is preheated and calculates the downward deflection.  The system automatically corrects all Z-axis values compensating for any warpage of the printed circuit board and eliminates the need for traditional and labor-intensive manual adjustment of the soldering program. Data from the Board Warp Sensing system is input into the PhotoScan software, which automatically adjusts Z-axis program values, compensating for any board deflection.

Integrated Solution. The Board Warp Sensing system fully integrates with closed-loop process controls contained in Nordson SELECT’s PhotoScan software providing seamless operation for your selective soldering process.  Nordson SELECT’s closed-loop process controls enable successful results for a full range of soldering applications and ensure stable and repeatable results for high-yield production.

Experience. With over a decade of selective soldering experience and more than a thousand systems currently in production, Nordson SELECT is committed to providing innovative solutions for all selective soldering needs.  Our global support network, including state-of-the-art application development labs, provides customers with world-class know-how and application expertise.

Compatible with Cerno^® 508.1, Integra^® 508.2, 508.3, 508.4 and 508.5 models