Customer Success: Underfill Upgrade Pays Off
Global Semiconductor Manufacturer Boosts Underfill UPH Over 50% with Upgraded Solution.
A leading global semiconductor manufacturer teamed up with a long-time partner, Nordson Electronics Solutions, to expand its annual production capacity.
The upgrade, several Forte® Series fluid dispensing platforms equipped with Forte MAX dual-valve jetting, ultimately exceeded estimated UPH gains while simultaneously reducing maintenance and material costs.
After working closely with the Nordson team to fine-tune their new solution, the company plans to further expand the use of the Forte Series into more of their global manufacturing sites.
The Forte Series, one of Nordson Electronics Solutions' newest platforms, combines enhanced dispensing software, dual-valve jetting, and 1.5G acceleration for swift point-to-point moves to take underfill UPH well beyond what's possible with older dispensing platforms and software.