SQ3000M2: Superior Performance ideal for Wirebond Applications

Advanced Inspection Metrology

Ever increasing requirements for durability and reliability, along with a continuous drive to smaller components means that ensuring quality product manufacturing is now more important than ever. 

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers.

Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer  applications, where the majority of chips are not developed at the most advanced process technologies, as well as for various memories.

But wire bonds also have a host of problems, and those problems are becoming more pronounced. They lack enough I/Os for increasingly heterogeneous devices, and they seem fragile and overly complicated compared with flip chips. 

Nordson TEST & INSPECTION experts offer various solutions for the 3D Structures Challenge Wire Bond Inspection.

The SQ3000M2 automated optical inspection (AOI) ensures product quality is maximized. Improve yields, processes and productivity and reduce costly returns from the field.

This high-speed, inline automated optical inspection and metrology system is ideal for wire bond applications including loop height measurements.  

‌Automated bond wire metrology:  Focus Variation Metrology (FVM) technology measures bond wire height for High Resolution Optical 3D Surface Metrology.

‌Powerful, proprietary lighting:  Multi-angle, multi-color programmable LED lighting combined with coax illumination ensures the highest measurement accuracy and maximizes defect detection.